Vacuum Chuck Channel Layout for Uniform Wafer Suction
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Solution Overview
Problem
The uneven vacuum pressure distribution on semiconductor wafers due to concentrated vacuum pressure in the center portion leads to excessive stress, increasing the risk of wafer cracking during processing.
Innovation Solution
A vacuum chuck with concentric annular walls and channels of varying dimensions and apertures to ensure uniform vacuum pressure distribution, providing equal suction force across the wafer surface, thereby reducing stress-related cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum pressure is applied to hold the wafer, then the wafer can be securely held during processing, but the vacuum pressure becomes concentrated in the center portion causing uneven distribution and excessive stress that may crack the wafer
Solution Approach 1:
The vacuum chuck is divided into multiple independent vacuum regions separated by annular walls. Each region has its own vacuum holes, allowing independent pressure control. This segmentation distributes the vacuum pressure across multiple zones rather than concentrating it in the center, reducing stress on the wafer while maintaining secure holding.
Solution Approach 2:
Different vacuum regions are designed with different numbers of vacuum holes and varying aperture sizes to create localized pressure adjustments. The outer regions have more holes with larger apertures to provide stronger suction where needed, while the center region has fewer holes with smaller apertures to reduce concentrated pressure and prevent wafer cracking.
2Manufacturing precision
If the wafer surface is warped or non-flat, then manufacturing defects may occur, but conventional flat vacuum chucks cannot provide adequate support for the entire wafer surface
Solution Approach 1:
The top surfaces of the annular walls are designed with curved profiles that match the typical warpage contour of semiconductor wafers. This curvature allows the vacuum chuck to conform to non-flat wafer surfaces, providing adequate support across the entire wafer including warped regions, thereby improving manufacturing precision without sacrificing adaptability to different wafer conditions.
Solution Approach 2:
The annular walls are strategically positioned and shaped to provide localized support at specific regions of the wafer where warpage typically occurs. By matching the wall profiles to the wafer contour, the system adapts to various wafer surface conditions while maintaining precise manufacturing capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures consistent vacuum adsorption force across the wafer, minimizing the risk of cracking and enhancing support for warped or non-flat wafers by matching annular wall profiles to the wafer's contour.
Implementation Method 1
a vacuum chuck, configured to adsorb the substrate on an upper surface of the vacuum chuck by vacuum suction
Data Source
AI summary
A substrate processing device is provided, including a processing chamber and a substrate carrying unit. The substrate carrying unit is disposed in the processing chamber. The substrate carrying unit includes a vacuum chuck, a shaft part and a driving part. The vacuum chuck adsorbs and holds a substrate through a vacuum suction. The shaft part has a rotation axis, and the shaft part is configured to support the vacuum chuck. The driving part is configured to drive the vacuum chuck and the shaft part to rotate around the rotation axis, wherein the vacuum chuck has a plurality of channels with different apertures inside, and the vacuum pressures in the channels are controlled by the size of the apertures so that the substrate is adsorbed on the vacuum chuck.