Vacuum Clamping Device Segmented Suction Grooves
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Solution Overview
Problem
Existing vacuum clamping devices require high vacuum performance for smaller workpieces and are sensitive to clogging, leading to inefficiencies and limited usage, especially when using microporous materials for clamping surfaces.
Innovation Solution
A vacuum clamping device with selectively actuated suction grooves controlled by a controller, allowing for efficient clamping of workpieces of varying sizes using a base plate material that minimizes scattered X-ray radiation for X-ray fluorescence testing, and featuring lifting pins and stop pins for precise handling and positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If microporous material is used for clamping surface, then workpieces are fixed flat and damage-free, but the clamping surface is sensitive to clogging and displacement, and requires high vacuum output
Solution Approach 1:
The clamping plate is divided into multiple independently controllable suction grooves instead of using a single microporous surface. Each suction groove can be activated separately based on workpiece size, eliminating the clogging and displacement sensitivity of microporous materials while maintaining reliable clamping.
Solution Approach 2:
The invention changes the clamping mechanism from microporous absorption to controlled vacuum application in discrete grooves. This parameter change allows adjustment of vacuum application zones and reduces sensitivity to surface contamination while maintaining clamping effectiveness.
2Reliability
If all suction openings are subjected to vacuum together, then workpieces are clamped securely, but increased vacuum device performance is required for smaller workpieces
Solution Approach 1:
The suction grooves are divided into multiple zones that can be independently activated. For smaller workpieces, only the necessary suction grooves are activated, reducing the total vacuum capacity required while maintaining secure clamping of the workpiece area.
Solution Approach 2:
Instead of applying vacuum to all suction openings, only the necessary portion is activated based on workpiece size. This partial action reduces vacuum device performance requirements while providing sufficient clamping force for the actual workpiece area.
3Device complexity
If larger suction grooves are used, then fewer grooves are needed, but the vacuum device must provide higher performance for the larger area
Solution Approach 1:
Multiple smaller suction grooves are segmented and independently controllable, allowing activation of only the necessary number and size of grooves for each workpiece. This avoids the need for fewer large grooves that would require higher vacuum performance.
Solution Approach 2:
The system dynamically adjusts which suction grooves are activated based on workpiece size and position. This dynamic configuration allows using smaller groove sizes with selective activation rather than fewer larger grooves, reducing peak vacuum performance requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient and reliable clamping of workpieces with reduced vacuum device performance requirements, energy savings, and improved handling capabilities, while allowing for accurate X-ray fluorescence testing with minimal radiation interference.
Implementation Method 1
a vacuum device (97) is provided for applying negative pressure to the at least one suction groove (22-26)
Implementation Method 2
the base plate (33) is made of a material in which the atomic number is selected such that when the primary radiation of an X-ray fluorescence measuring device is directed onto the workpiece, low scattered radiation is generated
Data Source
Figure 1~2
Figure 3~5
Figure 6~7
AI summary
The invention relates to a vacuum clamping device for clamping workpieces (19), in particular wafers, as well as a measuring device and a method for testing workpieces, in particular wafers, using X-ray fluorescence radiation. (See Figure 1)