Vacuum-Adsorbing Component Carrier for Stable Ring Transfer
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Solution Overview
Problem
Conventional component carriers for semiconductor manufacturing lack a configuration for temporarily fixing components like rings during transfer, leading to potential separation due to insufficient frictional force, causing components to move or escape during the transfer process.
Innovation Solution
A component carrier with a disk shape featuring first vacuum holes on the upper surface and second vacuum holes on the lower surface, connected by an air passage, along with a component support pad generating frictional force, to prevent separation by increasing the adsorption and frictional forces during transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional component carriers without vacuum holes are used, then the structure is simple, but components such as rings may move or escape during transfer due to insufficient frictional force
Solution Approach 1:
The carrier is divided into multiple functional zones with different vacuum hole configurations: first vacuum holes on the upper surface for direct component adsorption, second vacuum holes on the lower surface for transport hand connection, and air passages connecting them. This segmentation allows independent optimization of each zone's function while maintaining overall system reliability.
Solution Approach 2:
The air passage system is nested within the carrier structure, with air passages formed inside the carrier body to connect the upper and lower vacuum holes. This nested design integrates the vacuum transmission function into the carrier's structural framework, adding functionality without proportionally increasing external complexity.
2Reliability
If only frictional force is used to hold components, then the carrier structure remains simple, but components may separate during transfer process
Solution Approach 1:
The invention employs a vacuum pneumatic system with air passages, first vacuum holes, and second vacuum holes to create negative pressure for component adsorption. The vacuum system provides reliable component fixation through pressure differential, significantly improving adsorption stability compared to friction-only mechanisms.
Solution Approach 2:
The vacuum holes and air passages are pre-configured in the carrier structure before component loading. When a component is placed on the carrier, the vacuum system is activated to create adsorption force, ensuring the component is securely fixed before the transfer process begins, preventing any separation during movement.
3Reliability
If vacuum holes are added to the carrier, then component adsorption is improved, but manufacturing complexity increases
Solution Approach 1:
The first vacuum holes, second vacuum holes, and air passages are integrated into a single carrier component rather than being separate assemblies. This merging of functions into one monolithic structure simplifies manufacturing compared to assembling multiple separate parts, as the vacuum system can be formed directly during carrier fabrication through techniques like drilling, punching, or additive manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents the separation of components from the carrier during transfer by enhancing the frictional and adsorption forces, ensuring stable transport of components with complex shapes, such as rings, in semiconductor manufacturing processes.
Implementation Method 1
a first vacuum hole formed through the upper surface; a second vacuum hole formed through the lower surface; and an air passage provided between the first vacuum hole and the second vacuum hole
Implementation Method 2
a component support pad configured to include a through hole installed on the upper surface to generate frictional force with component part
Data Source
AI summary
Proposed is a component carrier for semiconductor manufacturing and component transport system using the same and, more particularly, to a component carrier for semiconductor manufacturing and component transport system using the same with an improved structure to prevent a ring from being separated from the component carrier for semiconductor manufacturing during a ring transport process by temporarily fixing the ring using vacuum adsorption. The carrier transports components while a lower surface thereof is in contact with a transport hand and an upper surface thereof is in contact with a component for semiconductor manufacturing. The carrier includes a first vacuum hole formed through the upper surface, a second vacuum hole formed through the lower surface, and an air passage provided between the first vacuum hole and the second vacuum hole.