Component Transfer Under Vacuum for Contamination-Free Bonding
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Solution Overview
Problem
Existing methods for transferring and preparing electronic components, such as chips, expose them to contamination due to atmospheric exposure during processing and bonding, leading to increased rejection rates and processing costs.
Innovation Solution
A method and device that apply a bonding layer to the component substrate before separation, allowing components to be fixed on a carrier substrate with minimal contamination, and maintain a vacuum environment throughout processing and bonding to prevent exposure to reactive substances like oxygen and nitrogen.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If components are transferred and processed in atmospheric conditions, then processing is simpler and easier, but component surfaces become contaminated with oxygen and nitrogen compounds
Solution Approach 1:
The patent applies vacuum environment as an inert atmosphere to prevent contamination of component surfaces during transfer and bonding operations. By maintaining vacuum conditions throughout the process, reactive substances like oxygen and nitrogen are excluded, preventing surface oxidation and contamination while allowing standard processing procedures to continue.
2Productivity
If components are repeatedly removed from vacuum device and exposed to atmosphere, then transfer and bonding can be completed, but component surfaces become contaminated increasing defect rate
Solution Approach 1:
The patent maintains continuous vacuum conditions throughout the entire transfer and bonding process, eliminating repeated exposure to atmospheric conditions. The vacuum environment is sustained from component preparation through transfer and bonding operations, ensuring continuous protection against contamination and maintaining component quality throughout the manufacturing sequence.
Solution Approach 2:
The patent combines multiple processing steps (component preparation, transfer, and bonding) into a single continuous vacuum environment. By merging these previously separate atmospheric and vacuum processes into one integrated vacuum operation, the system eliminates intermediate exposures to contaminating atmosphere while completing all necessary manufacturing steps.
3Ease of manufacture
If bonding layer is applied on carrier substrate, then components can be fixed, but bonding material contaminates the processing environment
Solution Approach 1:
The patent inverts the conventional approach by applying the bonding layer to the component substrate before transfer, rather than to the carrier substrate. This reversal ensures that bonding material remains confined to the component surfaces and does not spread across the carrier substrate or contaminate the vacuum environment, while still achieving secure component fixation.
Solution Approach 2:
The patent applies bonding layer locally only to the specific regions of the component substrate where components require fixation, rather than coating the entire carrier substrate. This localized application minimizes the total amount of bonding material used and prevents contamination of the processing environment, while providing sufficient adhesion for component fixation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces contamination, minimizes the use of bonding material, and ensures precise alignment and efficient transfer of components, resulting in lower defect rates and reduced processing costs by maintaining a contamination-free environment.
Implementation Method 1
maintain a vacuum environment throughout processing and bonding to prevent exposure to reactive substances like oxygen and nitrogen
Data Source
AI summary
The invention relates to a method and a device for preparing components on a carrier substrate and a method and a device for transferring components from a carrier substrate onto a product substrate.