Vacuum-Coupled Heat Sink Structure for Fast Test Attachment
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Solution Overview
Problem
Existing heat dissipation methods for high-performance computing devices, such as data centers, are either inefficient or costly, particularly during testing phases, with traditional bolted or screwed-on heatsinks being labor-intensive and immersion cooling being time and cost-inefficient.
Innovation Solution
A novel heatsink design utilizing vacuum pressure through a combination of through holes, hollow openings, and recessed grooves for efficient sealing and coupling, enhancing thermal management and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If traditional bolted or screwed-on heatsinks are used, then mechanical stability is ensured, but attachment and detachment process becomes labor-intensive and time-consuming
Solution Approach 1:
The patent replaces the traditional mechanical fastening system (bolts or screws) with a vacuum-based attachment system. The heatsink incorporates a vacuum chamber that, when evacuated, creates a strong holding force between the heatsink base and the processing plate, enabling rapid attachment and detachment without manual fastening operations.
Solution Approach 2:
The patent employs vacuum pressure (a pneumatic principle) to achieve secure attachment. By creating a pressure differential between the vacuum chamber interior and exterior, the system generates sufficient holding force to replace mechanical fasteners, significantly reducing attachment time and labor requirements.
2Productivity
If vacuum pressure is used for coupling, then attachment time is reduced, but sealing reliability must be maintained
Solution Approach 1:
The patent incorporates sealing elements (such as O-rings or gaskets) that are pre-installed in grooves around the vacuum chamber perimeter. These sealing components are positioned in advance to ensure that when the vacuum chamber closes against the processing plate, an immediate and reliable seal is formed, preventing vacuum leakage and maintaining attachment reliability.
Solution Approach 2:
The patent utilizes flexible sealing elements that can deform to accommodate minor surface irregularities between the heatsink base and the processing plate. This flexibility ensures consistent sealing contact across the interface, maintaining vacuum integrity and reliable attachment even with slight variations in surface flatness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heatsink design reduces attachment and detachment time, maintains cost-effectiveness, and ensures efficient thermal management, making it suitable for various cooling solutions and applications.
Implementation Method 1
the through hole is configured to apply a differential force to the metal plate... the differential force includes vacuum... application of the differential force couples the heat sink apparatus to a boilerplate
Data Source
AI summary
A heat sink apparatus is provided. The heat sink apparatus includes metal plate. The metal plate includes a through hole and a recessed groove around a circumference of a first surface of the metal plate. The recessed groove is configured to hold a gasket to couple the heat sink apparatus to a boilerplate upon application of a coupling force between the heat sink apparatus and the boilerplate using the through hole.