Vacuum-Deposited Layer for Plating Adhesivity
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Solution Overview
Problem
The barrier film formed on the outer surface of substrates during the plating process can be easily peeled off due to external forces, leading to issues in multilayer substrate manufacturing.
Innovation Solution
A plating method and system that involves forming a vacuum-deposited layer on the substrate as an underlying layer, followed by a plating process using a plating liquid to create a plating layer with high adhesivity, which includes forming a Cu diffusion barrier film by stacking and baking Co—W—B layers to enhance metal bonding and reduce stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a barrier film is formed on the outer surface of the substrate by the plating process, then the Cu diffusion barrier function is achieved, but the plating layer is easily peeled off by external forces during substrate processing
Solution Approach 1:
A vacuum-deposited layer is introduced as an intermediary between the substrate and the plating layer. This intermediate layer improves the bonding between the substrate and the plating layer, preventing the plating layer from peeling off during substrate processing while maintaining the Cu diffusion barrier function.
Solution Approach 2:
The vacuum-deposited layer is formed in advance before the plating process. This preliminary action prepares the substrate surface with enhanced adhesion properties, ensuring that the subsequent plating layer will bond strongly and resist peeling during processing.
2Strength
If the barrier film is baked to remove moisture and strengthen metal bonds, then the bond between metals is enhanced, but the plating layer remains susceptible to peeling under external force
Solution Approach 1:
The vacuum-deposited layer serves as a mediator that addresses the peel resistance issue independently of the baking process. While baking enhances metal bonds within the plating layer, the vacuum-deposited intermediary layer provides additional bonding interface between the substrate and plating layer, ensuring peel resistance even under external forces.
3Reliability
If a multilayer wiring structure is manufactured with through-via-holes, then electrical connection between wiring substrates is achieved, but the plating layer on the outer surface may peel off causing defects in the multilayer substrate
Solution Approach 1:
The vacuum-deposited layer acts as an intermediary that prevents plating layer peeling throughout the multilayer substrate manufacturing process. This ensures that the through-via-holes maintain their structural integrity and electrical connection reliability, reducing defects in the final multilayer substrate.
Solution Approach 2:
By forming the vacuum-deposited layer before the plating process, the substrate is prepared with enhanced adhesion properties that persist through subsequent manufacturing steps, including the formation of through-via-holes and stacking of wiring substrates, thereby preventing defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vacuum-deposited layer improves the adhesivity of the plating layer, preventing it from being damaged or peeled off during substrate processing, thus ensuring the integrity of the multilayer substrate.
Implementation Method 1
a vacuum-deposited layer forming process of forming a vacuum-deposited layer on the substrate by performing a vacuum deposition process on the substrate
Implementation Method 2
a plating layer forming process of forming a plating layer having a preset function on the vacuum-deposited layer by performing the plating process on the substrate with a plating liquid
Data Source
AI summary
A plating method can improve adhesivity with a substrate. The plating method of performing a plating process on the substrate includes forming a vacuum-deposited layer 2A on the substrate 2 by performing a vacuum deposition process on the substrate 2; forming an adhesion layer 21 and a catalyst adsorption layer 22 on the vacuum-deposited layer 2A of the substrate 2; and forming a plating layer stacked body 23 having a first plating layer 23a and a second plating layer 23b which function as a barrier film on the catalyst adsorption layer 22 of the substrate 2. By forming the vacuum-deposited layer 2A, a surface of the substrate 2 can be smoothened, so that the vacuum-deposited layer 2A serving as an underlying layer can improve the adhesivity.