Vacuum Drum Substrate Holder with Automated Transfer Jig
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Solution Overview
Problem
Carousel type sputtering apparatuses face inefficiencies in substrate handling, requiring manual operation under atmospheric pressure, leading to prolonged evacuation times and complex configurations, which hinder productivity and contaminate substrates.
Innovation Solution
A thin film forming apparatus with a rotatable drum type substrate holder that allows for automatic transfer and securing of substrates using a substrate fixing jig, performed in a vacuum environment, utilizing a transferring mechanism and securing means that operate within the evacuatable chamber, enabling horizontal or axial movement and electrical control for efficient substrate exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual substrate handling is performed under atmospheric pressure, then substrate exchange can be done simply, but evacuation time increases and productivity decreases
Solution Approach 1:
The patent replaces manual mechanical substrate handling with an automated transferring mechanism that operates within the vacuum chamber. The transferring mechanism includes a transferring arm with a substrate holding portion that can automatically pick up substrates from a substrate storage unit and place them on the substrate holder, eliminating the need for manual operations under atmospheric pressure.
Solution Approach 2:
The patent introduces a substrate fixing jig as an intermediary component that facilitates automatic substrate transfer. The fixing jig includes a substrate holding portion and a fixing portion that can be automatically engaged and disengaged by the transferring mechanism, serving as a mediator between the substrate and the handling system.
2Productivity
If a spare chamber and moving means are added to enable automatic substrate exchange, then substrate handling efficiency improves, but apparatus configuration becomes complicated and larger
Solution Approach 1:
The patent merges the substrate storage function and the substrate transfer function into a single integrated unit within the vacuum chamber. The substrate storage unit is positioned adjacent to the substrate holder, and the transferring mechanism operates in the same chamber space, combining multiple functions without requiring separate chambers.
Solution Approach 2:
The patent utilizes the radial space within the vacuum chamber by positioning the substrate storage unit and substrate holder at different radial positions. The transferring mechanism moves substrates along a radial path, effectively using the chamber's radial dimension to accommodate multiple functional components without increasing the chamber's axial or lateral footprint.
3Object-affected harmful factors
If substrates are handled under atmospheric pressure, then contamination is reduced, but evacuation time increases and working efficiency decreases
Solution Approach 1:
The patent performs all substrate transfer and exchange operations within the vacuum environment of the chamber, using the vacuum itself as a clean, contamination-free atmosphere. The transferring mechanism and substrate storage unit are both located within the vacuum chamber, ensuring substrates never暴露 to atmospheric contaminants during handling.
Data Source
AI summary
A thin film forming apparatus such that a substrate can be easily fixed/removed to/from the outer circumferential surface of a drum type substrate holder through a simple arrangement.The drum type substrate holder (5) is supported in a horizontal posture rotatably about a horizontal rotational shaft in a film deposition chamber A jig (13) holding a substrate (12) fixedly is transferred by an arm horizontally onto the outer circumferential surface of the drum type substrate holder (5), and an end part (13b) of the substrate fixing jig (13) can be secured by a securing device (14) provided at the corner part (5a) of the outer circumferential surface of the drum type substrate holder (5).