Vacuum Drying Electronic Devices Without Disassembly

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Solution Overview

Problem

Existing methods for drying electronic devices after moisture intrusion are inefficient, often requiring disassembly and can damage the device if excessive heat is applied, leading to data loss and corrosion.

Innovation Solution

A vacuum-pressure drying system using a heated platen within a vacuum chamber to reduce vapor pressure and boiling points of liquids, allowing for effective drying without disassembly and minimizing the risk of damage to the electronic device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional heating methods are used to dry electronic devices, then moisture can be removed, but the device may be damaged due to excessive heat and data can be lost

Engineering Contradiction:
Improvedevice integrityVSAvoiddrying temperature
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent changes the pressure parameter from atmospheric to vacuum conditions, which fundamentally alters the drying mechanism. By reducing pressure, the boiling point of water decreases, allowing moisture removal at lower temperatures that do not damage electronic components

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent utilizes phase transition of water from liquid to vapor under vacuum conditions. The reduced pressure environment enables water to evaporate and boil at temperatures below the damage threshold of electronic components, achieving effective drying without thermal damage

Inventive Principle:
Principle #36Phase transitions

2Reliability

If complete disassembly is performed to dry the device, then moisture can be removed from all areas, but the device becomes inoperable and data can be lost

Engineering Contradiction:
Improvedevice functionalityVSAvoiddisassembly requirement
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies segmentation by introducing multiple air injection ports at different locations (top, bottom, sides) of the device. This allows air to penetrate and reach moisture trapped in various internal cavities and tortuous paths without requiring physical disassembly of the device

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses injected air as an intermediary substance to reach and remove moisture from internal device cavities. The air acts as a carrier that can access tortuous paths and hidden areas within the sealed device, enabling complete drying while maintaining device integrity

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If general heating is applied to dry the device quickly, then drying time is reduced, but the heat may exceed maximum recommendations and cause damage

Engineering Contradiction:
Improvedrying speedVSAvoidthermal damage risk
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent uses pneumatic injection of air through multiple ports to accelerate moisture removal. This pneumatic method achieves rapid drying by forcing air through the device to extract moisture, providing a fast alternative to thermal heating that does not risk thermal damage to components

Inventive Principle:
Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system enables the safe and efficient drying of electronic devices, preserving digitized data and preventing corrosion, while allowing for quick drying cycles without the need for disassembly.

Implementation Method 1

A vacuum-pressure drying system using a heated platen within a vacuum chamber to reduce vapor pressure and boiling points of liquids

Methodology Applied
Scientific EffectVapor pressure reduction: Vapour Pressure

Implementation Method 2

A vacuum-pressure drying system using a heated platen within a vacuum chamber to reduce vapor pressure and boiling points of liquids

Methodology Applied
Scientific EffectVacuum: Vacuum

Implementation Method 3

A vacuum-pressure drying system using a heated platen within a vacuum chamber

Methodology Applied
Scientific EffectConduction heating: Conduction (thermal)

Data Source

PatentUS20250116460A1Methods and apparatuses for drying electronic devices
Publication Date: 2025.04.10 REVIVE ELECTRONICS LLC
  • US20250116460A1 patent drawing
  • US20250116460A1 patent drawing
  • US20250116460A1 patent drawing

AI summary

Methods and apparatuses for drying electronic devices are disclosed. An exemplary method comprises: placing a portable electronic device into a drying chamber; providing a first air channel, wherein the first air channel connects the drying chamber and a moisture-reducing device; generating a first air flow through the first air channel; removing a first moisture from an interior of the portable electronic device to an exterior of the portable electronic device; detecting moisture removed from the portable electronic device; pausing the generating the first air flow through the first air channel based on the amount of moisture; providing a second air channel, wherein the second air channel connects the moisture-reducing device and an evacuation channel; generating a second air flow through the second air channel; and removing a second moisture from the moisture-reducing device.