Vacuum Drying Electronic Devices via Heated Platen
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Solution Overview
Problem
Conventional methods fail to effectively dry electronic devices without disassembly after exposure to water or moisture, risking damage to the device and loss of digitized data due to high temperatures and torturous paths for moisture removal.
Innovation Solution
A vacuum-pressure drying system using a heated platen within a vacuum chamber that reduces vapor pressure, allowing liquids to boil off at lower temperatures, combined with air injection for enhanced drying, prevents damage and retains data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If general heating is employed to dry the device, then moisture can be removed, but damage can occur to the electronics and components due to excessive temperatures
Solution Approach 1:
The system changes the pressure parameter to create a vacuum environment, which fundamentally alters the boiling point of water. This allows moisture to be removed at temperatures below the damage threshold for electronic components, resolving the contradiction between effective drying and temperature protection
Solution Approach 2:
The invention utilizes phase transition of water from liquid to vapor at reduced pressure. By maintaining vacuum conditions, water evaporates and is removed from the device at low temperatures, achieving moisture removal without the harmful high temperatures that would damage electronics
2Quantity of substance
If the device is heated to remove moisture, then drying can occur, but the moisture cannot exit due to torturous paths for removal
Solution Approach 1:
By changing the pressure parameter to vacuum conditions, the system creates a strong pressure gradient that drives moisture vapor through the torturous paths and out of the device. The vacuum pressure overcomes the resistance of narrow channels and complex internal geometries, enabling effective moisture removal without disassembly
Solution Approach 2:
The system uses vacuum pressure differential to move moisture vapor through the device's internal pathways. The pressure gradient created by vacuum evacuation forces the vapor through torturous paths and out through available openings, solving the exit difficulty problem
3Quantity of substance
If complete disassembly is performed to dry the device, then moisture can be removed, but the device complexity increases and data may be lost
Solution Approach 1:
By changing to vacuum pressure conditions, the system enables moisture removal through the device's existing external openings without requiring disassembly. The vacuum penetrates through the sealed enclosure and draws moisture out through torturous paths, maintaining device integrity and avoiding data loss while achieving complete drying
Solution Approach 2:
The vacuum environment acts as an inert atmosphere that penetrates the sealed device enclosure. This allows moisture removal through the vacuum pressure differential without needing to open or disassemble the device, preserving both complexity and data integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system allows for safe and efficient drying of electronic devices without disassembly, preventing damage and ensuring the integrity of digitized data by reducing vapor pressure and utilizing air injection for quicker evaporation.
Implementation Method 1
a heated platen that can be automatically controlled to heat electronics, such as an inoperable portable electronic device, via conduction
Implementation Method 2
based on lowering the vapor pressure and the boiling points of liquids
Implementation Method 3
The decreased pressure provides an environment whereby liquid vapor pressures can be reduced, allowing lower boiling points of any liquid or wetting agent within the chamber
Implementation Method 4
The heated conductive platen, being housed in a convective box, radiates heat and can heat other portions of the vacuum chamber (e.g., the outside of the vacuum chamber) for simultaneous convection heating
Implementation Method 5
a vacuum chamber with a heated platen under automatic control... from which air is evacuated
Data Source
AI summary
Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device. Embodiments include heating the gas supplied into the interior of the electronic device with pump used to decrease pressure within the electronic device and/or a separate heater. Still other embodiments include controlling the temperature of the gas supplied into the electronic device. Still further embodiments automatically control, such as by using an electronic processor, some or all aspects of the drying of the electronic device.