Vacuum Drying Electronic Devices Using Heated Platen

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Solution Overview

Problem

Conventional methods fail to effectively dry electronic devices without disassembly after moisture intrusion, often causing damage or data loss due to excessive heat, as moisture cannot easily exit through torturous paths within the device.

Innovation Solution

A vacuum-pressure drying system using a heated platen in a vacuum chamber that reduces vapor pressure, allowing liquids to boil off at lower temperatures, combined with air injection to enhance drying speed and prevent component damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional heating methods are used to dry electronic devices, then drying speed is improved, but component damage occurs due to excessive heat

Engineering Contradiction:

Improvedrying speedVSAvoidcomponent damage

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent utilizes phase transition of water from liquid to vapor through vacuum evaporation. By reducing atmospheric pressure in the vacuum chamber, water boils and evaporates at lower temperatures, enabling effective moisture removal without subjecting electronic components to damaging high temperatures.

Inventive Principle:

Principle #36Phase transitions

Solution Approach 2:

The patent creates a vacuum environment (inert atmosphere with removed air molecules) to prevent oxidation and other atmospheric reactions during the drying process. This controlled environment protects sensitive electronic components while moisture is being removed through evaporation.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

2Productivity

If complete disassembly is performed to remove moisture, then drying effectiveness is improved, but device complexity and repair difficulty increase

Engineering Contradiction:

Improvedrying effectivenessVSAvoiddisassembly complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent separates the drying function from the electronic device structure itself by placing the device in an external vacuum chamber. This allows the drying process to occur independently without requiring disassembly of the device, maintaining structural integrity while achieving effective moisture removal.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The vacuum chamber acts as an intermediary environment that enables moisture removal without direct contact or disassembly of the device. The chamber provides the controlled vacuum atmosphere necessary for evaporation while the device remains intact and assembled.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Quantity of substance

If general heating is applied to dry the device, then moisture removal is improved, but data loss occurs due to temperature exceeding component limits

Engineering Contradiction:

Improvemoisture removalVSAvoiddata loss

Core Design Contradiction:

Quantity of substanceVSLoss of information

Solution Approach 1:

The patent exploits the phase transition property of water where it converts from liquid to vapor at lower temperatures under reduced pressure. This allows complete moisture removal through evaporation without applying temperatures that would damage heat-sensitive electronic components and stored data.

Inventive Principle:

Principle #36Phase transitions

Solution Approach 2:

The patent changes the physical parameter of atmospheric pressure by creating a vacuum environment. This parameter change fundamentally alters the boiling point of water, enabling moisture removal at temperatures safe for electronic components and data preservation.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables safe and efficient drying of electronic devices without disassembly, preserving data and preventing corrosion by boiling off moisture as a gas at lower temperatures, thus maintaining the integrity of the devices.

Implementation Method 1

A vacuum-pressure drying system using a heated platen in a vacuum chamber that reduces vapor pressure, allowing liquids to boil off at lower temperatures

Methodology Applied

Scientific EffectVapor pressure reduction: Vapour Pressure

Implementation Method 2

allowing liquids to boil off at lower temperatures

Methodology Applied

Scientific EffectBoiling: Boiling

Implementation Method 3

heated platen in a vacuum chamber that reduces vapor pressure, allowing liquids to boil off at lower temperatures

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 4

combined with air injection to enhance drying speed and prevent component damage

Methodology Applied

Scientific EffectFluid flow:

Data Source

PatentUS10690413B2Methods and apparatuses for drying electronic devices

Publication Date: 2020.06.23 REVIVE ELECTRONICS LLC

AI summary

Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device.