Vacuum Ejector Pin for Semiconductor End Effector Release
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Solution Overview
Problem
The inefficient disassociation of elements from vacuum draws in semiconductor processing using traditional end effectors can damage the elements and expose them inadequately to processing conditions, leading to contamination and suboptimal processing outcomes.
Innovation Solution
A vacuum ejector system with a pliable vacuum cup and a spring-loaded ejector pin having multiple ports at its tip, which applies vacuum to grip the element and efficiently releases it by breaking the seal, allowing for precise control and swift disengagement from the vacuum chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional vacuum draws are used to hold elements during semiconductor processing, then elements can be gripped and transported, but the disassociation process is inefficient and may damage the element
Solution Approach 1:
The vacuum draw is segmented into multiple vacuum cups, each capable of independently gripping and releasing elements. This segmentation allows for more controlled and efficient disassociation compared to a single vacuum source, reducing element damage while maintaining gripping effectiveness.
Solution Approach 2:
The system transitions from static vacuum holding to dynamic vacuum control by introducing a vacuum ejector pin that can actively break the vacuum seal. This dynamic mechanism allows rapid and controlled release of elements, significantly improving disassociation efficiency while preventing damage through precise timing and force control.
2Manufacturing precision
If traditional vacuum draws are used to hold elements, then elements can be transported, but inadequate exposure to processing conditions may occur due to inefficient disassociation
Solution Approach 1:
The vacuum ejector pin provides dynamic control over the vacuum release timing, ensuring elements are held precisely during transport and then rapidly released for processing. This dynamic control optimizes the exposure time to processing conditions, preventing both inadequate and excessive exposure.
Solution Approach 2:
The system prepares for rapid disassociation by pre-positioning the vacuum ejector pin and maintaining vacuum readiness. This preliminary preparation ensures that when element release is required, the transition is immediate and precise, optimizing processing exposure without time loss.
3Object-affected harmful factors
If traditional vacuum draws are used, then elements can be gripped, but contamination risk increases due to inefficient disassociation
Solution Approach 1:
By segmenting the vacuum system into multiple cups with individual control, the patent enables more precise control over element release. This segmentation reduces contamination risk by ensuring complete and timely disassociation, while the modular nature of segmented design limits the complexity increase to manageable levels.
Solution Approach 2:
The vacuum ejector pin acts as an intermediary mechanism between the vacuum source and the element. It mediates the release process by actively breaking the vacuum seal, ensuring clean and controlled disassociation that minimizes contamination risk while adding only one additional component to the system.
4Reliability
If multiple vacuum cups are used to grip elements, then gripping capability is improved, but device complexity increases
Solution Approach 1:
The end effector is segmented into multiple vacuum cups that can be independently controlled. This segmentation improves gripping reliability by distributing the gripping force across multiple points and allowing selective activation, while the modular segmented structure makes the complexity manageable through standardized components.
Solution Approach 2:
Each vacuum cup is designed to perform multiple functions: gripping, transporting, and controlled release of elements. This multi-functionality reduces the need for additional specialized components, thereby improving gripping reliability without proportionally increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables improved disassociation of elements from the vacuum, reducing the risk of damage and ensuring adequate exposure to semiconductor processes, thereby enhancing processing efficiency and minimizing contamination.
Implementation Method 1
a vacuum cup having a mouth capable of sealing to the gripped element to provide a vacuum chamber that enables the application of the vacuum to the gripped element
Implementation Method 2
an ejector pin actuator that is capable of moving the vacuum ejector pin toward the gripped element through the vacuum chamber in the y-axis until the sealing of the mouth is broken and the gripped element is ejected from the vacuum cup; The ejector pin actuator may be, for example, a spring
Data Source
AI summary
An apparatus, system and method for providing a vacuum ejector for an end effector. Embodiments may include at least an end effector and a vacuum chamber for gripping an element during semiconductor processing. The end effector may include at least two clamp arms for placing a gripped element; a vacuum cup having a mouth capable of sealing to the gripped element to provide a vacuum chamber to the gripped element; a vacuum ejector pin extending into the vacuum chamber and including a plurality of ports substantially at a tip thereof proximate to the gripped element, wherein the vacuum is applied by the plurality of ports; and an ejector pin actuator that is capable of moving the vacuum ejector pin toward the gripped element through the vacuum chamber in the y-axis until the sealing of the mouth is broken and the gripped element is ejected.