Vacuum Elastomer Bonding for Sputtering Targets
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Solution Overview
Problem
Current methods for bonding sputtering targets to backing plates are inefficient, leading to issues with air pocket formation and inadequate bonding in physical vapor deposition processes.
Innovation Solution
A method and apparatus using an elastomeric adhesive and a metal mesh, where a vacuum is applied to compress the backing plate and sputtering target together, effectively removing air pockets and ensuring a strong bond, utilizing a differential pressure system with chambers and pumping lines to facilitate the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods are used to bond sputtering targets to backing plates, then the bonding process is simple, but air pockets form within the adhesive leading to inadequate bonding
Solution Approach 1:
The bonding apparatus is divided into separate upper and lower chambers that can be independently evacuated, allowing systematic removal of air pockets from different regions of the adhesive layer during the bonding process
Solution Approach 2:
Vacuum pressure is applied through the evacuated chambers to compress the adhesive layer and remove air pockets, using pneumatic pressure differential to achieve reliable bonding without complex mechanical compression systems
2Reliability
If vacuum compression is applied to remove air pockets from adhesive, then bonding reliability improves, but the bonding process time increases
Solution Approach 1:
The adhesive is applied and initially compressed before bonding to pre-remove excess air pockets, reducing the time required for vacuum compression during the actual bonding process
Solution Approach 2:
The vacuum compression is maintained continuously throughout the bonding process without interruption, ensuring complete removal of air pockets while minimizing total process time through optimized vacuum levels
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a robust and efficient bonding of sputtering targets to backing plates, reducing the risk of bowing and ensuring uniform electrical and thermal contact, which enhances the reliability and consistency of the physical vapor deposition process.
Implementation Method 1
evacuating the lower chamber
Implementation Method 2
The backing plate and the sputtering target tile are sandwiched between the metal plate and a lower chamber bottom wall as the pressure differential between the chambers urges the metal plate downwards
Implementation Method 3
providing an elastomeric adhesive layer between the sputtering target tile and the backing plate
Implementation Method 4
removing air pockets from the adhesive by compressing the backing plate and the at least one sputtering target tile, wherein the compressing consists of applying a vacuum
Data Source
AI summary
The present invention includes a method and apparatus for bonding a sputtering target to a backing plate. In one embodiment, a sputtering target is vacuum bonded to a backing plate using an elastomeric adhesive and a metal mesh. The vacuum pulls the backing plate and sputtering target together while also removing air pockets that inevitably form within the adhesive during adhesive deposition and backing plate attachment.