Vacuum Endblock Electrical Contact for Sputtering Target
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Solution Overview
Problem
Conventional sputtering target systems face challenges in maintaining efficient power transfer and cooling, leading to reduced sputtering rates and potential system failures due to the location of electrical contacts at atmospheric pressure, which hinders efficient operation and longevity.
Innovation Solution
The electrical contacts, such as brushes, are relocated to an area under vacuum pressure between the collector and rotor, allowing for improved cooling and power transfer, enhancing the sputtering process by maintaining both the rotor and collector in a vacuum environment, thus facilitating efficient water cooling and increasing the sputtering rate by up to 20%.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electrical contacts are located at atmospheric pressure, then the system structure is simpler and easier to maintain, but the cooling efficiency is reduced and sputtering rate decreases
Solution Approach 1:
The patent moves the electrical contact interface from the atmospheric pressure dimension to the vacuum chamber dimension, creating a new spatial arrangement where brushes contact the collector inside the vacuum chamber. This dimensional transition enables simultaneous achievement of efficient cooling and power transfer while maintaining vacuum integrity through properly positioned seals.
2Reliability
If electrical contacts are located at atmospheric pressure, then the sealing requirements are reduced, but the cooling efficiency and power transfer effectiveness are compromised
Solution Approach 1:
The patent introduces seals as intermediary elements that mediate between the vacuum chamber and atmospheric pressure environment. By positioning seals at specific locations where the collector or rotor penetrate the chamber wall, the system maintains vacuum integrity while allowing electrical contacts and cooling channels to function effectively inside the vacuum chamber.
3Productivity
If electrical contacts are moved under vacuum, then cooling efficiency improves and sputtering rate increases, but the sealing requirements become more stringent
Solution Approach 1:
The patent implements seals and vacuum-tight connections in advance during system assembly, before operation begins. This preliminary action ensures that when electrical contacts operate under vacuum, the sealing system is already in place to maintain vacuum integrity, allowing efficient cooling and power transfer without requiring complex real-time sealing mechanisms.
4Ease of repair
If electrical contacts are located at atmospheric pressure, then maintenance is easier, but heat dissipation is insufficient leading to potential failures
Solution Approach 1:
The patent replaces atmospheric pressure cooling with vacuum-based liquid cooling channels integrated into the collector and rotor structures. By substituting air-based heat dissipation with direct liquid cooling through channels inside the vacuum chamber components, the system achieves superior heat dissipation efficiency while maintaining the ability to service components by accessing the vacuum chamber.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the sputtering rate and maintains system reliability by efficiently cooling and powering the sputtering target, reducing heat and pressure differences, and preventing failures.
Implementation Method 1
a first cooling area through which liquid flows for cooling the fixed conductive collector
Implementation Method 2
a second cooling area, separate from the first cooling area, through which liquid flows for cooling the rotor and target
Implementation Method 3
the electrical power transfer structure, the rotor, and the collector are each located in an area under vacuum having pressure less than atmospheric pressure
Data Source
AI summary
An endblock (4) for a rotatable sputtering target (1), such as a rotatable magnetron sputtering target, is provided. A sputtering apparatus, including one or more such endblock(s), includes locating the electrical contact(s) (e.g., brush(es)) (18) between the collector (20) and rotor (22) in the endblock(s) in an area (8) under vacuum (as opposed to in an area (9) at atmospheric pressure).