Vacuum Evaporation Device Center Source Baffle
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Solution Overview
Problem
Existing vacuum evaporation devices result in non-uniform thickness distribution of coating films due to the placement of evaporation sources at the edge of the base plate, leading to thicker coatings near the source and thinner coatings farther away.
Innovation Solution
The evaporation source is positioned at the center of the base plate, with a baffle assembly having an adjustable opening that allows evaporation substances to pass through, ensuring uniform coating thickness across the substrate. This configuration includes multiple movable point evaporation sources that can be alternately positioned under the baffle opening, allowing for precise control of evaporation and doping of substances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the evaporation source device is placed at the edge part of the base plate, then the structure is simpler and easier to manufacture, but the coating film thickness becomes non-uniform
Solution Approach 1:
The patent applies asymmetry by positioning the evaporation source device at the center of the base plate rather than at the edge, creating a symmetric radiation pattern that ensures uniform coating thickness distribution across the substrate surface, thereby resolving the contradiction between manufacturing simplicity and coating uniformity
2Device complexity
If the evaporation source device is placed at the edge part of the base plate, then the device structure is simpler, but the coating film thickness near the source becomes much greater than away from the source
Solution Approach 1:
The patent employs asymmetry by relocating the evaporation source from the edge to the center position, transforming the asymmetric thickness distribution (thick near source, thin far away) into a symmetric uniform distribution, thus achieving both device simplicity and coating uniformity
3Object-affected harmful factors
If a baffle opening cover plate is used to occlude the baffle opening during preheating, then evaporation substance pollution is prevented, but the coating film thickness uniformity is not improved
Solution Approach 1:
The patent addresses the pollution prevention function by introducing a movable baffle opening cover plate that can occlude the baffle opening during preheating, separating the preheating and evaporation processes in time, while the main solution for thickness uniformity comes from the central positioning of the evaporation source
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a more uniform coating film thickness and ensures the same proportion of doped components, enhancing the performance and uniformity of the coating across the substrate.
Implementation Method 1
the evaporation substance evaporated out from the evaporation source device is deposited on the surface of the substrate
Implementation Method 2
a vacuum evaporation device, including an evaporation chamber, at least one evaporation source device disposed in the evaporation chamber
Implementation Method 3
in accordance with the molecular diffusion free-path principle
Data Source
AI summary
The invention provides a vacuum evaporation device, belongs to the field of vacuum evaporation and can solve the problem of non-uniform thickness of a coating film formed by an existing vacuum evaporation device. The vacuum evaporation device provided by the present invention comprises an evaporation chamber, at least one evaporation source device disposed in the evaporation chamber, and a baffle assembly disposed between the evaporation source device and a substrate to be evaporated. The evaporation source device is disposed within the center region of a base plate of the evaporation chamber. The baffle assembly is provided with a baffle assembly opening used for allowing evaporation substances to pass therethrough and corresponding to the position of the evaporation source device. As the evaporation source device is disposed within the center region of the evaporation chamber, the thickness of a coating film formed on the surface of the substrate is more uniform.