Vacuum Fiber Holder for Stress-Free Optical Chip Alignment
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Solution Overview
Problem
Existing fiber alignment and attachment methods, particularly mechanical clamping, cause misalignment, stress, and interference with neighboring fibers, leading to broken bonds and reduced adhesive strength, especially at 127 micron pitch, and require complex manufacturing processes.
Innovation Solution
An inverted vacuum-based system using a 3D printed fiber holder with a concave surface and minimal solid angle contact to gently secure fibers, eliminating mechanical stress and interference, while allowing for simplified manufacturing and improved clearance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If mechanical clamping is used to hold fibers, then strong grip and rotational alignment capability are achieved, but fiber stress, misalignment, and interference with neighboring fibers occur
Solution Approach 1:
The patent replaces the mechanical clamping system with a vacuum-based holding system. Instead of using mechanical clamps that physically grip the fiber from the sides, the invention uses vacuum pressure applied through a holder to gently secure the fiber from above, eliminating mechanical stress and misalignment issues while maintaining secure holding capability
Solution Approach 2:
The patent employs vacuum (pneumatic) pressure to hold the fiber in place. A vacuum holder applies negative pressure to the fiber through contact points, providing secure grip without mechanical clamping forces. This pneumatic approach allows for stress-free holding while maintaining precise alignment and preventing interference with neighboring fibers
2Reliability
If vacuum channels are micro machined to create vacuum alignment, then fiber holding is achieved, but misalignment between components reduces vacuum pressure and causes fiber misalignment
Solution Approach 1:
The patent merges the vacuum holder with the alignment platform into a single integrated component. The vacuum holder is positioned directly on the translation stage, eliminating separate micro-machined vacuum channels and their associated alignment problems. This integration ensures that vacuum application points are precisely aligned with the fiber without requiring complex component alignment
3Ease of manufacture
If fiber arrays are made thicker for manufacturing, then ease of handling is improved, but clearance tolerance between chip carrier and fiber array bottom is reduced to less than 700 micron
Solution Approach 1:
The patent changes the approach from horizontal clearance management to vertical positioning control. By using a translation stage with fine positioning capability, the system can accommodate thicker fiber arrays while maintaining precise alignment with the chip facet. The clearance issue is resolved by precise vertical positioning rather than relying on horizontal spacing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vacuum-based system ensures precise alignment and attachment of fibers at 127 micron pitch without stress, reducing bond failure and manufacturing complexity, and enabling simultaneous alignment of multiple fibers with improved clearance and reduced interference.
Implementation Method 1
The state of the art requires the use of multiple micro machined components to create the vacuum channels
Data Source
AI summary
System and method for performing fiber optic alignment and attachment of an industry standard single fiber optic cable or fiber array to the facet of an optical chip. The proposed invention provides a means to gently hold and release a single fiber or fiber array while maintaining tolerance restrictions created by the presence of neighboring fibers or chip carriers via an inverted vacuum system.