Vacuum Processing Device with Resilient Cord for Fiber Bobbin Exchange
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Solution Overview
Problem
Vacuum processing devices for forming coatings on silicon carbide fibers require elongated reaction chambers, leading to prolonged vacuum pump operation and limited productivity due to the need for extensive evacuation after exposure to atmosphere during fiber exchange and loading processes.
Innovation Solution
A vacuum processing device with a chamber configuration that maintains a depressurized state, using a feeding roller, processor, capture device, and resilient cord to manage and wind reinforcement fibers without exposing the main chamber to atmosphere, allowing for bobbin exchange while maintaining a vacuum.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate processing devices (sputtering device, annealing device, ion injection device) are used for semiconductor device fabrication, then processing quality and reliability are improved, but facility cost, space requirements, and processing time increase
Solution Approach 1:
The patent combines multiple separate processing functions (sputtering, annealing, ion injection) into a single integrated processing device. The device includes a sputtering chamber for film deposition, an annealing chamber for heat treatment, and an ion injection chamber for doping, all within one facility. This merging eliminates the need for multiple separate devices while maintaining processing quality, thereby reducing facility cost, space requirements, and overall system complexity.
Solution Approach 2:
The processing device is designed with multi-functionality to perform various semiconductor fabrication steps in sequence. The same vacuum chamber and substrate handling system are used for sputtering, annealing, and ion injection processes. This universal design allows one device to replace multiple specialized devices, reducing the number of facilities needed while maintaining the reliability of each individual processing step.
2Reliability
If multiple separate processing devices are used, then processing quality is improved, but processing time and substrate transfer requirements increase
Solution Approach 1:
By merging multiple processing functions into a single integrated device, the patent eliminates the need to transfer substrates between separate facilities. The substrate remains in the same vacuum chamber throughout sputtering, annealing, and ion injection processes, eliminating transfer time and reducing the risk of contamination during transfer operations.
Solution Approach 2:
The integrated processing device enables continuous processing without interrupting the vacuum environment. The substrate can be processed sequentially through sputtering, annealing, and ion injection without breaking vacuum or requiring transfer to another facility, maintaining continuous useful action and reducing total processing time while preserving processing quality.
3Manufacturing precision
If conventional sputtering methods are used, then film deposition is achieved, but resin material damages and fine hole formation are problematic
Solution Approach 1:
The patent applies parameter changes by controlling the substrate potential at -5V during sputtering and adjusting the Ar gas flow rate to 30 sccm. These parameter modifications reduce the kinetic energy of incident particles, preventing resin material damage and avoiding fine hole formation in the resist layer, while still achieving high-quality film deposition through controlled atomic layer-by-layer growth.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient exchange of bobbins and introduction of new fibers within a depressurized environment, significantly reducing the time required to achieve a sufficient vacuum, thereby enhancing the productivity of the vacuum processing device.
Implementation Method 1
a vacuum processing device including a processing chamber in which a vacuum is applied
Implementation Method 2
a sputtering power supply that supplies sputtering power for forming a film by sputtering
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
A device of executing vacuum processing on a reinforcement fiber has a chamber capable of keeping the chamber as a whole in a depressurized state; a feeding roller so disposed as to hang the reinforcement fiber down in the chamber; a processor so disposed in the chamber as to pass the reinforcement fiber hung down in the chamber through the processor; a capture device so disposed as to capture and keep a leading end of the reinforcement fiber passing the processor and vertically falling down in place; a winding bobbin configured to wind the reinforcement fiber processed by the processor; and a resilient cord withdrawn in synchronism with the winding bobbin from a first position where the resilient cord surrounds the leading end kept in place by the capture device to a second position where the resilient cord gets in contact with and leads the reinforcement fiber to the winding bobbin.