Growth Substrate Separation Using Vacuum Gripper Laser Lift-Off

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Solution Overview

Problem

The existing methods for separating the growth substrate from the functional layer system in microelectronic component production are often unreliable and destructive, potentially impairing the operation of the microelectronic component.

Innovation Solution

A method involving a vacuum gripper with a sealing zone that applies negative pressure to the reverse side of the growth substrate, allowing for non-destructive separation of the functional layer stack from the growth substrate using a laser to weaken the bond between them, ensuring uniform force distribution and minimizing damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the laser lift-off method is used to separate the functional layer stack from the growth substrate, then the separation can be achieved, but the process may cause damage to the microelectronic component and impair its operation

Engineering Contradiction:

Improveoperation reliabilityVSAvoidlaser-induced damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A liquid layer is introduced as an intermediary between the growth substrate and the laser beam. This liquid layer absorbs and dissipates the laser energy, preventing direct laser-induced damage to the functional layer stack while still enabling effective separation through controlled bond weakening at the substrate interface

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The liquid layer is applied beforehand to the growth substrate surface to cushion against the harmful effects of laser radiation. This protective layer is in place before laser irradiation begins, preventing damage to the microelectronic components during the separation process

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Reliability

If external force is applied to separate the growth substrate from the functional layer system, then separation can be achieved, but the force distribution may be non-uniform causing damage

Engineering Contradiction:

Improveseparation reliabilityVSAvoidmechanical damage from non-uniform force

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A liquid is used to transmit mechanical force uniformly across the growth substrate surface during separation. The hydraulic pressure distribution in the liquid ensures that the separating force is applied evenly across the entire substrate area, preventing localized stress concentrations that could damage the functional layer stack

Inventive Principle:

Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables a highly non-destructive separation of the growth substrate from the functional layer stack, ensuring the integrity and functionality of the microelectronic component, with the vacuum gripper's negative pressure providing a uniform force that overcomes adhesion forces without causing damage.

Implementation Method 1

utilizing incident radiation of a laser beam from the reverse side of the growth substrate through the growth substrate such that the laser beam is focused in a boundary region between the growth substrate and the functional layer system, and a bond between the growth substrate and the functional layer system in the boundary region is weakened or destroyed

Methodology Applied

Scientific EffectLaser irradiation: Laser

Implementation Method 2

a vacuum gripper having a sealing zone that circumferentially encloses an inner region is applied to the reverse side of the growth substrate, further to the applying, a negative pressure is generated in the inner region such that, by introduction of a separating force to the growth substrate, separation of the functional layer stack from the growth substrate is initiated in the inner region

Methodology Applied

Scientific EffectNegative pressure: Pressure Gradient

Data Source

PatentUS11799055B2Method and manufacturing system of producing microelectronic components with a layer structure

Publication Date: 2023.10.24 3D MICROMAC AG

AI summary

A method of producing microelectronic components includes forming a functional layer system; applying a laminar carrier to the functional layer system; attaching a workpiece to a workpiece carrier; utilizing incident radiation of a laser beam is focused in a boundary region between a growth substrate and the functional layer system, and a bond between the growth substrate and the functional layer system in the boundary region is weakened or destroyed; separating a functional layer stack from the growth substrate, wherein a vacuum gripper having a sealing zone that circumferentially encloses an inner region is applied to the reverse side of the growth substrate, a negative pressure is generated in the inner region such that separation of the functional layer stack from the growth substrate is initiated in the inner region; and the growth substrate held on the vacuum gripper is removed from the functional layer stack.