Vacuum Heating Cooling Substrate Base Mechanism
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Solution Overview
Problem
Existing vacuum heating/cooling methods for semiconductor and magnetoresistance element manufacturing face challenges such as prolonged heating and cooling times, contamination from residual gases, and the inability to maintain a high vacuum environment during continuous heating/cooling processes, leading to inefficiencies and quality issues in film formation.
Innovation Solution
A vacuum heating/cooling apparatus with a radiation energy source outside the chamber, a coolable substrate supporting base, and a substrate moving mechanism that positions the substrate for heating and cooling at separate locations within the same vacuum chamber, allowing for rapid and continuous heating and cooling while maintaining a high vacuum environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the substrate is heated by moving it to a separate heating chamber, then heating can be performed, but the processing time is prolonged and vacuum integrity is compromised
Solution Approach 1:
The patent combines the heating function with the substrate supporting base that already exists in the vacuum chamber. The base incorporates a heating element that can heat the substrate without requiring transfer to a separate heating chamber, thus maintaining vacuum integrity and reducing processing time.
Solution Approach 2:
The substrate supporting base is designed to serve multiple functions: it supports the substrate during deposition, heats the substrate through an integrated heating element, and can be cooled by introducing cooled gas. This multi-functionality eliminates the need for separate heating and cooling chambers.
2Temperature
If the substrate is cooled by introducing cooled gas, then cooling efficiency is improved, but the vacuum environment is degraded
Solution Approach 1:
The patent introduces cooled gas locally at specific locations around the substrate rather than filling the entire chamber. This localized cooling approach achieves efficient heat transfer to the substrate while minimizing the volume of gas introduced, thus preserving the overall vacuum environment.
Solution Approach 2:
The patent uses gas flow (pneumatic approach) to transfer thermal energy from the substrate. By controlling the flow of cooled gas through strategically positioned nozzles, efficient convective cooling is achieved while using minimal gas volume to maintain vacuum conditions.
3Stability of the object's composition
If the substrate is held in position during heating, then heating uniformity is improved, but the ability to switch between heating and cooling is reduced
Solution Approach 1:
The patent employs a movable substrate supporting base that can be dynamically repositioned within the vacuum chamber. During heating, the base holds the substrate in a fixed position for uniform heating. During cooling, the base can be moved to different locations to optimize cooling efficiency, thus providing both heating uniformity and operational versatility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables rapid and efficient heating and cooling of substrates within a high vacuum environment, reducing exposure time and contamination, and allowing for continuous processing without compromising vacuum integrity, thereby improving the quality of film formation and reducing processing time.
Implementation Method 1
a radiation energy source which radiates heating light; a window which transmits heating light through a vacuum seal member such as an O-ring
Implementation Method 2
a method of cooling a substrate while the substrate is left in a heating chamber without being moved to a cooling chamber, as disclosed in Patent Document 7, a method is known in which a cooled gas is introduced into the heating chamber for cooling by using convection of a gas
Implementation Method 3
by directly placing the substrate on a cooled substrate supporting base, the substrate is rapidly cooled by heat transfer
Data Source
AI summary
The present invention provides a vacuum heating/cooling apparatus capable of rapidly heating and also rapidly cooling only a substrate while a high vacuum degree is maintained after film-formation processing. The vacuum heating/cooling apparatus according to an embodiment of the present invention includes a vacuum chamber (1), a halogen lamp (2) which emits heating light, a quartz window (3) for allowing the heating light to enter the vacuum chamber (1), a substrate supporting base (9) having a cooling function, and a lift pin (13) which causes the substrate (5) to stand still at a heating position P3 and a cooling position P1 and moves the substrate (5) between the heating position P3 and the cooling position P1.