Selective Vacuum Hole Cleaning for Stable Substrate Holding

The patent implements a preliminary cleaning action by providing a cleaning fluid supply apparatus that supplies cleaning fluid to the vacuum holes before substrate treatment. This preliminary cleaning prevents abrasive deposition from blocking the vacuum holes, maintaining their functionality for substrate holding.

The patent ensures continuous cleaning action by maintaining a continuous supply of cleaning fluid to the vacuum holes during substrate treatment. This continuous action prevents abrasive accumulation, ensuring the vacuum holes remain unblocked and functional throughout the treatment process.

The patent segments the vacuum holes into multiple groups and provides cleaning fluid to each group through separate supply paths. This segmentation allows cleaning fluid to be supplied to multiple vacuum holes simultaneously while maintaining adequate pressure in each group, as the fluid is distributed through divided pathways rather than a single congested path.

The patent introduces intermediate distribution channels or manifolds that divide the cleaning fluid supply into multiple separate paths. These intermediaries enable the cleaning fluid to reach multiple vacuum holes simultaneously while maintaining pressure by distributing the flow through separate routes rather than requiring a single high-flow path.

The patent performs cleaning as a preliminary action before substrate treatment begins. By cleaning the vacuum holes in advance, the system ensures substrate position stability without requiring interruptions during the treatment process, thus maintaining productivity.

The patent implements continuous cleaning fluid supply during substrate treatment, allowing cleaning to occur simultaneously with treatment rather than requiring separate cleaning cycles. This continuous action maintains vacuum hole functionality throughout treatment without interrupting the process, preserving both substrate stability and productivity.