Vacuum Immersion Cooling Platform for Lower Boiling-Point Heat Removal
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Solution Overview
Problem
Traditional computing systems face inefficiencies in cooling due to the constant need for air cooling, and existing liquid cooling methods require constant fluid replenishment to prevent exposure of components to gaseous atmospheres, leading to reduced performance and potential damage.
Innovation Solution
A pressure-controlled vessel system utilizing a dielectric fluid that operates under vacuum conditions, allowing for immersion cooling with a condensing system to manage vapor and maintain a stable temperature, reducing the boiling point of the fluid and increasing cooling efficiency while minimizing fluid loss and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional air cooling is used, then components can be cooled, but energy consumption is high and cooling efficiency is low
Solution Approach 1:
The system utilizes phase transition of dielectric liquid between liquid and vapor states to achieve efficient heat removal. The liquid absorbs heat from components through evaporation, and the vapor is condensed and returned to liquid state, creating a continuous cooling cycle that is far more efficient than traditional air cooling methods
Solution Approach 2:
The invention employs hydraulic cooling principles by using liquid dielectric fluid to directly contact and cool the components. The liquid circulation system, including pumps and heat exchangers, enables efficient heat transfer from components to the cooling fluid, significantly reducing energy consumption compared to air cooling
2Productivity
If liquid cooling with direct contact is used, then cooling efficiency improves, but components are exposed to gaseous atmosphere causing fluid loss and contamination
Solution Approach 1:
The system operates within a sealed enclosure filled with dielectric liquid that creates an inert environment for the components. This liquid-filled sealed environment prevents oxidation and contamination of electronic components while maintaining efficient cooling, as the dielectric liquid does not react with component materials
Solution Approach 2:
The sealed enclosure captures vapor phase dielectric liquid that evaporates from components, condenses it back to liquid state, and returns it to the cooling bath. This phase transition cycle prevents fluid loss to the atmosphere while maintaining continuous cooling efficiency
3Temperature
If operating temperature is reduced, then cooling efficiency increases, but dielectric fluid vaporization temperature must be lowered
Solution Approach 1:
The system changes the pressure parameter of the dielectric liquid to lower its vaporization temperature. By operating at reduced pressure, the dielectric liquid can vaporize and condense at lower temperatures, enabling effective cooling at lower operating temperatures without excessive energy loss from vaporization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances cooling efficiency, increases computing density, and reduces energy consumption by maintaining components at lower temperatures and minimizing the need for fluid replenishment, while also reducing the risk of contamination and component damage.
Implementation Method 1
computer components and other electronics may be submerged in a dielectric or electrically non-conductive liquid in order to draw heat directly from the component into the liquid
Implementation Method 2
a condensing system in order to cool and convert gaseous dielectric fluid to liquid dielectric fluid
Implementation Method 3
The disclosed pressure management system allows the disclosed embodiment to operate under a vacuum, thereby reducing the temperature at which dielectric fluid vaporizes
Data Source
AI summary
A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created.