Vacuum Immersion Cooling Chassis for Server Heat Management
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Solution Overview
Problem
Traditional computing systems face inefficiencies in cooling due to the constant need for air cooling, which requires more energy and space, and existing liquid cooling methods often lose dielectric fluid when it vaporizes, leading to inadequate cooling and potential component damage.
Innovation Solution
A pressure-controlled vessel utilizing a dielectric fluid that vaporizes and condenses within a closed system, maintaining a vacuum to reduce the boiling point and allowing for direct heat transfer from components submerged in the fluid, with a condensing system to recycle the vapor back into liquid, enhancing cooling efficiency and density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by stationary object
If traditional air cooling is used, then components can be cooled, but energy consumption increases and space requirements increase
Solution Approach 1:
The patent changes the physical parameters of the cooling system by transitioning from air cooling to liquid dielectric fluid immersion cooling. This parameter change enables direct heat transfer from components to the liquid medium, significantly improving cooling effectiveness while reducing energy consumption compared to traditional air cooling systems
Solution Approach 2:
The patent utilizes phase transitions of the dielectric fluid, specifically the vaporization and condensation cycles, to enhance heat removal from components. The fluid absorbs heat by vaporizing near hot components and releases heat during condensation, creating an efficient thermal management cycle that improves cooling effectiveness
2Reliability
If liquid cooling with dielectric fluid is used, then cooling efficiency improves, but fluid loss occurs when vaporization happens
Solution Approach 1:
The patent implements a vapor recovery system that captures dielectric fluid vapor that escapes from the immersion cooling system and condenses it back to liquid form. This recovery mechanism prevents permanent fluid loss while maintaining the cooling efficiency benefits of liquid immersion cooling
Solution Approach 2:
The patent creates a controlled atmospheric environment within the server housing, using dielectric fluid vapor as an inert atmosphere that prevents oxidation and other chemical reactions while allowing heat transfer. This controlled environment minimizes unwanted fluid loss through combustion or chemical degradation
3Reliability
If components are submerged in dielectric fluid, then direct heat transfer improves cooling, but system complexity increases
Solution Approach 1:
The patent makes the dielectric fluid serve multiple functions simultaneously: it acts as a cooling medium for heat transfer, provides electrical insulation between components, and creates a controlled atmospheric environment. This multi-functionality reduces overall system complexity by eliminating the need for separate cooling channels, insulation layers, and atmospheric control systems
Solution Approach 2:
The patent merges the cooling system, electrical insulation system, and atmospheric control system into a single integrated dielectric fluid immersion system. This consolidation simplifies the overall architecture by combining multiple subsystems into one unified approach, reducing the number of separate components and interfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves cooling efficiency, allowing for increased component density and performance by maintaining components at stable temperatures and reducing energy consumption while preventing fluid loss, thus enhancing overall system performance and reliability.
Implementation Method 1
computer components and other electronics may be submerged in a dielectric or electrically non-conductive liquid in order to draw heat directly from the component into the liquid
Implementation Method 2
a condensing system in order to cool and convert gaseous dielectric fluid to liquid dielectric fluid
Implementation Method 3
The disclosed pressure management system allows the disclosed embodiment to operate under a vacuum, thereby reducing the temperature at which dielectric fluid vaporizes
Implementation Method 4
operate under a vacuum, thereby reducing the temperature at which dielectric fluid vaporizes
Data Source
AI summary
A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. Utilizing robotic arms and slot-in computing components located within chassis, a self-healing computing system may be created.