Vacuum Immersion Cooling Platform for Server Heat Management

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Solution Overview

Problem

Traditional computing systems face inefficiencies in cooling due to the need for constant fluid replenishment in immersion cooling systems, which can lead to decreased performance or component damage if the dielectric fluid level drops, and existing systems struggle with maintaining optimal temperatures and reducing contamination.

Innovation Solution

A pressure-controlled vessel utilizing a dielectric fluid with a low boiling point, combined with a vapor management system that condenses gaseous fluid back into liquid, maintaining a vacuum environment to enhance cooling efficiency and reduce contamination risks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If dielectric fluid is used for immersion cooling, then cooling efficiency is improved, but fluid level drop causes decreased performance or component damage

Engineering Contradiction:
Improvecooling efficiencyVSAvoidcomponent safety
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The system uses a vacuum pump to automatically maintain vacuum conditions and a vapor condensation system to continuously recycle evaporated dielectric fluid back into liquid form, eliminating the need for manual fluid replenishment and preventing fluid level drop that would cause component damage

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The vapor condensation system captures evaporated dielectric fluid vapor, condenses it back to liquid form, and returns it to the cooling bath, preventing fluid loss and maintaining constant fluid levels for reliable component cooling

Inventive Principle:
Principle #34Discarding and recovering

2Temperature

If vacuum environment is created to reduce dielectric fluid vaporization temperature, then cooling efficiency is improved, but system complexity increases

Engineering Contradiction:
Improvevaporization temperatureVSAvoidsystem complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The vacuum pump and vapor condensation system are integrated into a unified vapor management system that simultaneously maintains vacuum conditions and recycles dielectric fluid vapor, reducing overall system complexity while achieving the desired temperature reduction

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The vacuum pump operates continuously to maintain the vacuum environment, and the vapor condensation system continuously recycles evaporated fluid, ensuring uninterrupted cooling efficiency without requiring periodic system shutdowns or manual interventions

Inventive Principle:
Principle #20Continuity of useful action

3Productivity

If dielectric fluid is continuously replenished, then cooling performance is maintained, but fluid loss and contamination occur

Engineering Contradiction:
Improvecooling performanceVSAvoidfluid loss
Core Design Contradiction:
ProductivityVSLoss of substance

Solution Approach 1:

The vapor condensation system captures dielectric fluid vapor that would otherwise be lost, condenses it back to liquid form, and returns it to the cooling bath, eliminating fluid loss while maintaining continuous cooling performance

Inventive Principle:
Principle #34Discarding and recovering

Solution Approach 2:

The vacuum environment created by the vacuum pump reduces dielectric fluid vaporization and prevents contamination from external sources, allowing the system to maintain cooling performance without continuous fluid replenishment that would lead to loss and contamination

Inventive Principle:
Principle #39Inert atmosphere (Inert environment)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for increased computing density and performance by maintaining components at stable low temperatures, reducing energy consumption, and minimizing fluid loss, while preventing contamination and maintaining efficient cooling through vapor condensation and fluid recycling.

Implementation Method 1

draw heat directly from the component into the liquid

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

condensing system in order to cool and convert gaseous dielectric fluid to liquid dielectric fluid

Methodology Applied
Scientific EffectCondensation: Condensation

Implementation Method 3

operate under a vacuum, thereby reducing the temperature at which dielectric fluid vaporizes

Methodology Applied
Scientific EffectVaporization: Boiling

Data Source

PatentEP3854188B1Liquid immersion cooling platform
Publication Date: 2024.07.31 MODINE LLC
  • EP3854188B1 patent drawingFigure 1
  • EP3854188B1 patent drawingFigure 2
  • EP3854188B1 patent drawingFigure 3

AI summary

A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created.