Vacuum Insulation Laminate Structure for Low Heat Bridge Sealing

The patent uses a composite laminated structure consisting of multiple layers including polymer layers and a metal foil layer with specific thermal resistance (≥650 K/W) and Young's modulus (≥100 GPa). This composite structure combines the gas barrier properties of metal foils with the thermal resistance characteristics of specific metal compositions, while the adhesive layers between polymer and metal layers create a structure that reduces heat bridge formation through the exterior material.

The patent specifies precise parameter ranges for the metal foil layer: thermal resistance of at least 650 K/W and Young's modulus of at least 100 GPa. These parameter constraints optimize the balance between gas barrier performance and thermal resistance, preventing heat bridge formation while maintaining effective gas barrier properties without requiring excessive thickness.

The patent introduces adhesive layers at the interfaces between polymer layers and the metal foil layer. These adhesive layers have specific mechanical properties that differ from both the polymer and metal layers, creating a gradient structure that reduces stress concentration and improves bending workability during fabrication while maintaining the gas barrier integrity of the metal foil layer.

The adhesive layers are positioned beforehand at the interfaces between polymer and metal layers, creating a cushioning effect that absorbs and distributes stress during the folding and heat sealing processes. This pre-positioned adhesive cushioning prevents stress concentration that would otherwise cause pinholes and cracks in the exterior material during fabrication.