Compact Vacuum Interlock Chamber with Integrated Wafer Detection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In the semiconductor industry, there is a need for a compact vacuum interlock chamber that can efficiently transfer wafers between different pressure environments while ensuring wafer safety and preventing contamination during detection processes, as existing solutions are either too large or lack effective wafer status detection capabilities.
Innovation Solution
A chamber device with a multi-layer supporting structure and integrated detection systems, including light sources and sensors, to accurately position and detect wafers across varying pressure environments, ensuring precise placement and preventing damage or contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a compact vacuum interlock chamber is used, then the vacuumization time is reduced and productivity is improved, but the capability to detect wafer status is insufficient
Solution Approach 1:
The patent combines the vacuum interlock chamber with wafer status detection devices (light sources and sensors) into an integrated system. The detection devices are positioned within the chamber to detect wafer presence, positioning accuracy, and contamination status during the vacuum transfer process, eliminating the need for separate detection equipment while maintaining compact size.
Solution Approach 2:
The chamber serves multiple functions simultaneously: it acts as a vacuum interlock chamber for pressure equalization, a transfer chamber for moving wafers between environments, and a detection chamber for monitoring wafer status. This multi-functionality allows the compact chamber to perform vacuumization, wafer transfer, and status detection without requiring additional separate systems.
2Productivity
If a multi-layer supporting structure is used to support multiple wafers, then the productivity is improved, but the device complexity increases
Solution Approach 1:
The patent transitions from supporting wafers in a single layer to a multi-layer supporting structure arranged vertically within the chamber. This three-dimensional arrangement allows multiple wafers to be transferred simultaneously or sequentially, significantly improving productivity while the modular design of the layers keeps the structural complexity manageable.
Solution Approach 2:
The supporting structure is divided into multiple independent layers, each capable of supporting individual wafers. This segmentation allows for flexible configuration where each layer can be independently positioned and controlled, simplifying the overall system architecture while enabling high-throughput wafer processing.
3Measurement precision
If integrated detection systems with light sources and sensors are added, then the measurement precision is improved, but the device complexity increases
Solution Approach 1:
The patent replaces complex mechanical measurement systems with optical detection methods. Light sources emit beams that pass through or reflect off the wafers, and sensors detect the optical signals to determine wafer presence, positioning accuracy, and contamination status. This optical substitution provides high measurement precision while avoiding complex mechanical measurement mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient and non-destructive wafer detection and transfer between pressure environments, maintaining wafer safety and preventing contamination, even with a compact chamber design, by utilizing a multi-layer supporting structure and advanced detection systems.
Implementation Method 1
a first light source (161), mounted to the housing (10) and configured to emit a first light beam (1611) into the cavity (10a); a plurality of groups of first sensors (162) mounted to the housing (10) and arranged to be at least partially aligned in one-to-one correspondence with layers of the multi-layer supporting structure (13) respectively
Data Source
AI summary
The present disclosure provides a chamber device, which includes a housing, which defines an cavity therein, a first valve, provided on a first side of the housing, and configured to switch between a closed condition thereof, and an opened condition thereof where the housing is in communication with one of the first pressure environment and the second pressure environment therethrough, a switching device, fixed to the housing, and configured to align the first valve with a respective inlet of the one of the first pressure environment and the second pressure environment, a second valve, provided on a second side of the housing opposite to the first side, and configured to communicate the cavity with the first pressure environment or disconnect the cavity from the first pressure environment, and a pressure regulating device, provided on the housing and in communication with the cavity .