Vacuum Lamination Chamber Sequencing to Reduce Air Bubbles
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional lamination methods fail to effectively remove air bubbles between a sealing film and a substrate with highly undulating structures, leading to poor packaging yield.
Innovation Solution
A vacuum lamination method involving a device with movable upper and lower lamination units, evacuating a chamber formed around the substrate and sealing film before contact, then heating and pressing them together to reduce air bubbles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum is applied to extract residual gas between sealing film and substrate, then packaging yield is improved, but air bubbles still remain when substrate has highly undulating structure or surfaces are too closely attached
Solution Approach 1:
The patent applies preliminary action by first evacuating the chamber to create vacuum conditions before the sealing film and substrate surfaces come into contact. This preliminary vacuum application removes residual gas from the chamber environment before lamination occurs, preventing air bubbles from forming even when surfaces are closely attached or have undulating structures.
Solution Approach 2:
The patent creates an inert vacuum environment within the chamber before lamination. By evacuating the chamber to remove air and residual gases prior to bringing the sealing film and substrate together, the process eliminates the harmful atmosphere that would otherwise be trapped between surfaces, thereby preventing air bubble formation.
2Manufacturing precision
If sealing film and substrate are closely attached, then lamination quality is improved, but residual gas cannot be extracted leading to air bubbles
Solution Approach 1:
The patent performs the vacuum evacuation action before the sealing film and substrate are brought into close contact. This timing ensures that residual gas is removed from the chamber environment prior to lamination, allowing high-quality close attachment without trapping air bubbles between the surfaces.
Solution Approach 2:
The patent creates an inert vacuum environment before lamination occurs. By evacuating the chamber to remove air and residual gases prior to bringing the sealing film and substrate together, the process eliminates the harmful atmosphere that would otherwise be trapped between closely attached surfaces.
3Object-affected harmful factors
If vacuum evacuation is performed before sealing film and substrate contact, then air bubbles are reduced, but process complexity increases
Solution Approach 1:
The lamination device integrates multiple functions into a single system: it can evacuate the chamber to create vacuum conditions, heat the sealing film and substrate, and apply pressure for lamination. This multi-functionality allows the vacuum evacuation step to be incorporated without requiring separate dedicated equipment, thereby limiting the increase in process complexity.
Solution Approach 2:
The patent combines the vacuum evacuation function with the lamination process by integrating the evacuation mechanism into the lamination chamber. This merging of functions allows air bubble reduction through vacuum to be achieved as part of the existing lamination equipment rather than requiring separate complex systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Closely attaches the sealing film to the substrate, reducing air bubbles and improving packaging yield.
Implementation Method 1
evacuating the chamber
Implementation Method 2
heating the sealing film and the substrate
Data Source
AI summary
A vacuum lamination method, comprising providing a vacuum lamination device, which comprises an upper lamination unit and a lower lamination unit; providing a sealing film and a substrate; moving at least one of the upper lamination unit and the lower lamination unit, the upper lamination unit and the lower lamination unit are brought close to and joined to each other, and the upper lamination unit and the lower lamination unit jointly surround and form a chamber, the sealing film and the substrate are accommodated in the chamber, and the sealing film and the substrate are not in contact with each other; evacuating the chamber; moving at least one of the sealing film and the substrate to bring the sealing film and the substrate close to each other, so that the sealing film is laminated onto the substrate.