Vacuum Lamination System for Rigid Substrates
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Solution Overview
Problem
The challenge lies in achieving proper lamination of rigid or semi-rigid substrates, such as glass to LCD screens, with uniformity and effectiveness, particularly in ensuring secure bonding while minimizing deformation and ensuring environmental protection.
Innovation Solution
A substrate lamination system involving a vacuum chamber with a pressure-sensitive adhesive layer between substrates, where the substrates are aligned and evacuated, followed by pressure application using a flexible membrane to ensure secure attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If pressure is applied to laminate substrates, then bonding strength is improved, but substrate deformation increases
Solution Approach 1:
The patent applies differential pressure to the substrates during lamination, where pressure is applied to one substrate while the other substrate is supported, creating a pressure gradient that enables strong bonding without causing deformation of the rigid substrates
Solution Approach 2:
A flexible membrane is introduced as an intermediary element between the pressure source and the substrates. This flexible membrane distributes pressure uniformly and prevents direct contact that could cause deformation, while still enabling effective bonding through the membrane
2Strength
If rigid substrates are used for protection, then structural strength is improved, but lamination uniformity deteriorates
Solution Approach 1:
The patent uses differential pressure application where one rigid substrate is pressed while the other is supported, creating a pressure gradient that achieves uniform lamination across the substrate interface without compromising the structural strength of the rigid substrates
Solution Approach 2:
A flexible membrane serves as a mediator between the pressure application point and the rigid substrates, allowing uniform pressure distribution across the substrate interface while maintaining the structural integrity and rigidity of the substrates
3Strength
If vacuum evacuation is performed, then adhesive bonding is improved, but processing time increases
Solution Approach 1:
The patent implements vacuum evacuation to create a pressure differential that enhances adhesive bonding between substrates, while the differential pressure approach allows for more efficient processing compared to conventional methods
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures strong, uniform lamination of substrates with minimal deformation, enhancing the thermal operating range and providing environmental protection, while maintaining the integrity of the substrates.
Implementation Method 1
disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; evacuating the vacuum chamber
Implementation Method 2
disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; applying pressure to at least one of the first substrate and the second substrate
Data Source
AI summary
The present disclosure is directed to a substrate lamination system and method. A method for laminating substrates may comprise: (a) disposing a pressure-sensitive adhesive later between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) evacuating the vacuum chamber; (d) applying pressure to at least one of the first substrate and the second substrate. A system for laminating substrates may comprise: (a) means for disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a substantially planar surface of a second substrate; (b) means for disposing the first substrate, pressure-sensitive adhesive layer and second substrate within a vacuum chamber; (c) means for evacuating the vacuum chamber; (d) means for applying pressure to at least one of the first and second substrates.