Vacuum Deposition Lamination for Superconductive Metal Sheets
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current metal sheet bonding methods like plasma welding and laser welding are economically inefficient, and soldering limitations include restricted material selection, porosity, and oxidation, leading to reduced bonding force.
Innovation Solution
A lamination apparatus and method using a process chamber with vacuum deposition to inject a metallic bonding material between metal sheets, ensuring high-density bonding without oxidation and controlling vapor pressure for uniform thickness and enhanced bonding force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If soldering is used to bond metal sheets, then bonding is achieved at lower temperature (430°C or lower), but bonding material selection is limited and oxidation occurs reducing bonding force
Solution Approach 1:
The patent applies vacuum environment to prevent oxidation of bonding materials during the bonding process. By removing oxygen from the environment, the bonding materials are protected from oxidization, maintaining their bonding force and reliability even at lower temperatures.
2Ease of manufacture
If bonding materials are used in soldering, then metal sheets can be bonded, but materials become porous dropping in density and bonding force diminishes
Solution Approach 1:
The patent changes the physical state parameters of bonding materials by using vacuum deposition. This process deposits materials in a controlled manner, preventing porosity and ensuring uniform density distribution in the bonded structure.
Solution Approach 2:
The patent replaces traditional mechanical soldering processes with vacuum deposition technology. This substitution eliminates the capillary action and melting processes that cause porosity, achieving dense and uniform bonding material distribution.
3Reliability
If plasma welding or laser welding is used to fully seal the interior, then complete sealing is achieved, but costs are much higher reducing economical efficiency
Solution Approach 1:
The patent uses cost-effective bonding materials and vacuum deposition process instead of expensive plasma welding or laser welding equipment. This approach achieves adequate sealing quality at much lower cost, improving economical efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high-density, oxidation-resistant bonding with improved bonding force and reduced manufacturing costs, enabling efficient bonding of various metal sheets, including superconductive and stabilization tapes for enhanced electrical connectivity.
Implementation Method 1
a pump connected to one side of the process chamber for making the interior of the process chamber a vacuum
Implementation Method 2
injecting a bonding material between the first and the second metal sheets supplied
Implementation Method 3
bonding the first and the second metal sheets with each other
Data Source
AI summary
The present invention is directed to a lamination method. The lamination method includes making the interior of a process chamber a vacuum, the process chamber including a first and a second metal sheet, supplying the first and the second metal sheets, injecting a bonding material between the first and the second metal sheets supplied, bonding the first and the second metal sheets with each other, and heating the bonded metal sheets. The first metal sheet is a superconductive tape, and the second metal sheet is stabilization metal tape.