Vacuum LED Transfer Chamber for Precise Backplane Bonding

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Solution Overview

Problem

Challenging to attach light-emitting diodes (LEDs) to a backplane with high yield in electronic displays.

Innovation Solution

An apparatus and method involving a backing board, sealing member, transparent panel, vacuum source, and laser radiation source to transfer LEDs by drawing a vacuum and using laser radiation to irradiate LEDs on a backplane, facilitating precise alignment and bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional methods are used to attach LEDs to a backplane, then the process is simpler, but the bonding yield and quality are low

Engineering Contradiction:
Improvebonding yieldVSAvoidtransfer apparatus complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The transfer apparatus segments the LED attachment process into distinct functional zones: a vacuum chamber for precise positioning, a laser radiation source for bonding, and a support structure for the backplane. This segmentation allows each component to perform its specific function optimally, achieving high bonding yield while maintaining manageable system complexity through modular design

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a vacuum chamber as an intermediary environment between the LED source and backplane. This vacuum environment serves as a mediator that enables precise positioning and control during the transfer process, significantly improving bonding quality without requiring direct complex mechanical manipulation

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If manual or conventional automated methods are used for LED transfer, then the equipment is simpler, but the alignment precision and bonding accuracy are insufficient

Engineering Contradiction:
Improvealignment precisionVSAvoidvacuum and laser system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces complex mechanical alignment systems with a vacuum-based positioning system combined with laser radiation for bonding. The vacuum chamber provides stable, precise positioning without requiring complex mechanical stages, while the laser source delivers accurate bonding with high spatial precision, achieving superior manufacturing precision with reduced mechanical complexity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the physical parameter of the transfer environment from atmospheric pressure to vacuum. This parameter change fundamentally improves alignment precision by eliminating air interference and enabling better control of the transfer process, while the vacuum system itself remains relatively simple in structure

Inventive Principle:
Principle #35Parameter changes

3Reliability

If pressure is applied to ensure LED contact with backplane, then bonding contact is improved, but non-uniform pressure causes defects and damage

Engineering Contradiction:
Improvebonding qualityVSAvoidnon-uniform pressure damage
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent uses vacuum pressure (a pneumatic principle) applied uniformly across the entire LED array in the vacuum chamber. This uniform vacuum pressure ensures consistent contact between all LEDs and the backplane without the non-uniform localized pressure that causes defects, achieving high bonding quality while avoiding pressure-related damage

Inventive Principle:
Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves the bonding quality and accuracy of LEDs to a backplane, enhancing display device yield by reducing non-uniformity and damage during the transfer process.

Implementation Method 1

a vacuum source configured to draw a vacuum on the space

Methodology Applied
Scientific EffectVacuum: Vacuum

Implementation Method 2

drawing a vacuum on the space such that the transparent panel presses the plurality of first LED coupons toward the backplane

Methodology Applied
Scientific EffectPressure differential: Pressure Gradient

Implementation Method 3

a laser radiation source that is configured to direct a laser radiation through the transparent panel to irradiate a LED coupon on the backplane in the space

Methodology Applied
Scientific EffectLaser radiation: Laser

Data Source

PatentUS12568840B2Apparatus and method for transferring light-emitting diodes
Publication Date: 2026.03.03 SAMSUNG ELECTRONICS CO LTD
  • US12568840B2 patent drawing
  • US12568840B2 patent drawing
  • US12568840B2 patent drawing

AI summary

An apparatus for transferring light-emitting diodes (LEDs) includes a backing board for supporting a backplane, a sealing member formed on the backing board around a periphery of the backplane, a transparent panel formed on the sealing member such that a space is formed between the backing board and the transparent panel, and a vacuum source for drawing a vacuum on the space.