Vacuum Lid Arms Secure Semiconductor Substrates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current transportation systems for semiconductor substrates often result in damage and shifting during shipping due to inadequate retention, leading to abrasion and potential breakage, especially when handling multiple substrates in a space-efficient manner.
Innovation Solution
A tray-based transportation system with a lid and vacuum-sealed packaging bag that uses arms to exert pressure on the substrates, ensuring secure stacking and retention without direct force from the tray's sidewalls, thereby preventing movement and damage during transit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If semiconductor substrates are stacked in a tray for space-efficient transportation, then the quantity of substrates transported is improved, but the substrates are prone to shifting and damage due to inadequate retention
Solution Approach 1:
The lid is divided into multiple arms (at least two arms) that can independently exert pressure on different portions of the stacked substrates. This segmentation allows for distributed retention force across multiple substrates simultaneously, securing them in place while maintaining space-efficient stacking in the tray.
Solution Approach 2:
The patent combines multiple retention functions into a single lid structure with multiple arms. The arms work together to simultaneously secure multiple substrates through vacuum pressure, merging the retention function that would otherwise require separate mechanisms for each substrate into one integrated system.
2Reliability
If the lid directly exerts force on the substrates through rigid contact, then the retention is improved, but the substrates are more prone to damage and abrasion
Solution Approach 1:
The vacuum environment acts as an intermediary mechanism. Instead of direct mechanical contact and force application, the vacuum pressure transmitted through the packaging medium gently presses the substrates against the tray bottom and sidewalls, securing them without concentrated contact points that would cause damage or abrasion.
Solution Approach 2:
The system uses vacuum pressure (pneumatic principle) to retain substrates. The vacuum force is distributed uniformly across the substrate surfaces, providing secure retention without the need for rigid mechanical contact or localized pressure points that would cause damage.
3Reliability
If rigid sidewalls are used to prevent substrate movement, then the retention is improved, but the substrates are more prone to damage from direct contact
Solution Approach 1:
The vacuum environment serves as an intermediary that transmits retention force without requiring direct rigid contact between sidewalls and substrates. The vacuum pressure gently pushes substrates against the sidewalls, providing retention while avoiding damage from mechanical contact.
Solution Approach 2:
The patent replaces direct mechanical contact-based retention with a vacuum pressure-based system. Instead of relying on physical interference from rigid sidewalls, the vacuum field provides the retention force, eliminating the harmful mechanical contact while maintaining substrate stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively secures semiconductor substrates in place during transportation, reducing the risk of damage and ensuring easy handling by maintaining substrates in a stable position until the vacuum is released.
Implementation Method 1
The packaging bag is configured to be evacuated and sealed such that the tray and the lid arranged in the packaging bag are vacuum sealed inside the packaging bag, and, when a vacuum is generated inside the packaging bag, the lid is pressed onto the tray and the arms of the lid move towards the plurality of semiconductor substrates
Data Source
Figure 1A~1E
Figure 2~4C
Figure 5A~6B
AI summary
A transportation system (10) for semiconductor substrates (12) comprises a tray (16) comprising a bottom and circumferential sidewalls, wherein the tray (16) has an opening on its top side and is configured to receive a plurality of semiconductor substrates (12) through the opening, wherein the plurality of semiconductor substrates (12) are stacked onto each other in the tray (16) in parallel to the bottom of the tray (16). The transportation system (10) further comprises a lid (14) comprising a cover plate (24) and at least two arms (26) extending from the cover plate (24), wherein the at least two arms (26) are configured to be inserted into the tray (16) between the sidewalls of the tray (16) and the plurality of semiconductor substrates (12), and the cover plate (24) is configured to cover the opening of the tray (16) when the lid (14) is fully mounted to the tray (16). The transportation system (10) further comprises a packaging bag (18) configured to enclose the tray (16) with the plurality of semiconductor substrates (12) stacked therein and the lid (14) arranged thereon. The packaging bag (18) is configured to be evacuated of air and sealed such that the tray (16) and the lid (14) arranged in the packaging bag (18) are vacuum sealed inside the packaging bag (18), and, when a vacuum is generated inside the packaging bag (18), the lid (14) is pressed onto the tray (16) and the arms (26) of the lid (14) move towards the plurality of semiconductor substrates (12), thereby exerting pressure on the plurality of semiconductor substrates (12) from at least two sides and holding the plurality of semiconductor substrates (12) in place.