Semiconductor Vacuum Pumping Lines With Vortex Particle Separation
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Solution Overview
Problem
Integrated circuit fabrication facilities face challenges in maintaining high efficiency and reducing manufacturing costs due to the buildup of solid particles in vacuum systems, which can cause vacuum pump seizures and reduce processing efficiency.
Innovation Solution
The implementation of particle decontamination units that utilize rotational gas-flow and centrifugal forces to separate and trap solid particles from the gas stream in vacuum pumping lines, using stationary-vane, rotatory-fan, and helical-tube designs to create vortical flows that concentrate particles for removal before they reach the vacuum pump.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum pumps are used to maintain low pressure in processing chambers, then vacuum conditions are achieved for semiconductor fabrication, but solid particles accumulate in pumping lines causing pump seizures
Solution Approach 1:
The vortex generator and particle trapper are installed in the pumping line to perform preliminary particle removal before gas reaches the vacuum pump. The vortex generator creates rotational flow that throws particles outward, and the trapper captures them, preventing accumulation that would cause pump seizures.
Solution Approach 2:
The particle trapper acts as an intermediary device between the processing chamber and vacuum pump. It intercepts solid particles in the gas stream, trapping them in a collection chamber, thereby protecting the vacuum pump from particle contamination while maintaining vacuum functionality.
2Productivity
If processing continues without particle removal, then manufacturing efficiency is maintained, but solid deposits build up reducing system performance
Solution Approach 1:
The vortex generator continuously creates rotational flow in the pumping line during normal operation, automatically throwing particles outward toward the trapper. This self-cleaning mechanism operates continuously without interrupting fabrication processes, maintaining both productivity and reliability.
Solution Approach 2:
The particle removal system operates continuously during vacuum pumping, with the vortex generator maintaining rotational flow and the trapper continuously capturing particles. This uninterrupted particle removal prevents deposit buildup while fabrication proceeds, sustaining both efficiency and reliability.
3Reliability
If particle decontamination units are installed, then pump seizures are prevented, but device complexity increases
Solution Approach 1:
The system replaces complex mechanical particle removal methods with a streamlined vortex-based approach. The vortex generator uses simple helical vanes to create rotational flow, and gravity combined with centrifugal force performs particle separation, eliminating the need for complex mechanical scrapers or filters.
Solution Approach 2:
The system uses gas flow dynamics and centrifugal forces generated by vortex motion to achieve particle separation. The rotational gas flow naturally throws particles outward, and the trapper design utilizes pressure differentials and gravity to capture particles, replacing complex mechanical systems with pneumatic-hydraulic principles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the risk of vacuum pump seizures and slows down the buildup of solid deposits, enhancing the efficiency and reliability of vacuum systems in integrated circuit fabrication.
Implementation Method 1
utilize rotational gas-flow and centrifugal forces to separate and trap solid particles from the gas stream
Implementation Method 2
create vortical flows that concentrate particles for removal
Data Source
AI summary
Methods and devices are provided wherein rotational gas-flow is generated by vortex generators to decontaminate dirty gas (e.g., gas contaminated by solid particles) in pumping lines of vacuum systems suitable for use at a semiconductor integrated circuit fabrication facility. The vacuum systems use filterless particle decontamination units wherein rotational gas-flow is applied to separate and trap solid particles from gas prior to the gas-flow entering a vacuum pump. Methods are also described whereby solid deposits along portions of pumping lines may be dislodged and removed and portions of pumping lines may be self-cleaning.


