Vacuum Lock Gate for Wafer Transport Contamination
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Solution Overview
Problem
In semiconductor process systems, contamination, damage, and oxidation of substrates occur during transport and treatment due to exposure to different pressures and environments, leading to inefficiencies and potential contamination between process steps.
Innovation Solution
A modular system where the main treatment module acts as a vacuum-tight lock to adjacent pre-treatment and post-treatment modules, allowing for independent temperature control and minimizing exposure to external influences, with loading and unloading managed through lock gates to prevent contamination and optimize processing conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If wafers are transported with cassettes between process modules, then substrate handling and process sequence flexibility are improved, but contamination, damage, and oxidation occur during transport
Solution Approach 1:
The patent introduces a transfer chamber as an intermediary environment between process modules. This transfer chamber maintains controlled atmospheric conditions (inert gas or vacuum) to prevent contamination, oxidation, and damage during wafer transport between modules, while still allowing cassette-based handling and process sequence flexibility.
Solution Approach 2:
The transfer chamber is filled with inert gas (such as nitrogen or argon) or maintained under vacuum to create a protective atmosphere during wafer transport. This inert environment prevents oxidation and contamination of the wafers while they are being moved between process modules.
2Productivity
If large pressure differences are overcome for rapid pressure changes, then processing time is reduced, but substrate damage and long equilibration times occur
Solution Approach 1:
The transfer chamber allows pressure equilibration to occur before wafers are transferred into the main process chamber. By preparing the pressure environment in advance in the transfer chamber, the system avoids sudden large pressure differences that could damage substrates, while still enabling rapid overall processing.
Solution Approach 2:
The pressure change process is segmented into multiple stages: first, the transfer chamber undergoes pressure adjustment; then wafers are transferred; finally, the main process chamber undergoes pressure adjustment. This segmentation allows gradual pressure changes that protect substrates while maintaining processing efficiency.
3Ease of operation
If the main treatment module is directly exposed to the environment for loading and unloading, then ease of operation is improved, but contamination and oxidation occur
Solution Approach 1:
The transfer chamber serves as an intermediary between the environment and the main treatment module. Wafers are loaded into the transfer chamber from the environment, and then transferred to the main treatment module only when ready, maintaining a controlled environment throughout while preserving operational convenience.
Solution Approach 2:
The loading and unloading operations are extracted from the main treatment module and performed in the separate transfer chamber. This extraction allows the main treatment module to remain sealed and protected from environmental contamination while still enabling easy loading and unloading through the transfer chamber interface.
4Productivity
If process modules are coupled for parallel processing, then productivity is improved, but system complexity increases
Solution Approach 1:
The transfer chamber is designed as a universal interface that can connect to multiple different process modules (CVD, PVD, etching, etc.). This multi-functional design enables parallel processing of multiple wafer batches with different process requirements while using a single standardized transfer chamber, thereby reducing overall system complexity.
Solution Approach 2:
The system is segmented into independent process modules that can be configured in parallel, each connected to a common transfer chamber. This modular segmentation allows for parallel processing while keeping each module relatively simple and manageable, with the transfer chamber coordinating the complexity of inter-module operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures minimal contamination and damage during substrate processing, enables efficient parallel processing, and reduces pressure and temperature differences, thereby optimizing throughput and maintaining pristine conditions for substrate handling.
Implementation Method 1
the pre-treatment chamber and/or the main treatment chamber and/or the after-treatment chamber can be heated, in particular separately, by means of a heating device
Implementation Method 2
the main treatment module acts as a vacuum-tight lock for an adjacent pre-treatment, main treatment or post-treatment module
Data Source
Figure 1a~1b
Figure 2a~2c
Figure 3~4
AI summary
The device (1) has a main lock gate connecting a pre-treatment chamber (2) with a main process chamber (3) of a main treatment module (10) in a vacuum-tight manner. A pre-treatment module (9) is switchable as a lock for loading of the main process chamber with substrates. Another main lock gate connects the main process chamber with a post-treatment chamber (4) in a vacuum-tight manner. A post-treatment module (11) is switchable as another lock for discharging the substrates from the main process chamber, where the locks are formed as pressure locks and/or temperature locks. An independent claim is also included for a method for processing substrates or pairs of substrates.