Vacuum Mounting Tool for Curved Components and Bubble Reduction
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Solution Overview
Problem
The varying curvature of electronic components makes it necessary to have different mounting tools for components of different sizes, and existing tools often fail to effectively remove air bubbles between components and substrates, leading to poor connections and mounting failures.
Innovation Solution
A mounting tool with a holder and expanded portion that uses negative pressure to hold and deform the electronic component, allowing it to be mounted without changing the tool's shape, and includes ventilation paths to manage air bubbles and ensure proper contact with the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If different curved shapes are prepared for mounting tools to match electronic components of different sizes, then mounting precision is improved, but device complexity increases
Solution Approach 1:
The mounting tool uses a single holder with a flat holding surface that can accommodate electronic components of various sizes through adjustable holders, eliminating the need for multiple curved holders with different shapes. The holder can be positioned at different locations to adapt to different component sizes, achieving universal applicability.
Solution Approach 2:
The holder is designed to be movable along the holding surface rather than being fixed in a specific curved position. This dynamic adjustment capability allows the same holder to adapt to different electronic component sizes and shapes, resolving the contradiction between mounting precision and device complexity.
2Device complexity
If a fixed curved shape mounting tool is used, then device complexity is reduced, but mounting precision deteriorates due to inability to match different component curvatures
Solution Approach 1:
The holder can be dynamically repositioned along the holding surface to match different electronic component sizes, maintaining mounting precision without requiring multiple fixed-shaped tools. This dynamic adaptability keeps the device simple while achieving precise mounting.
Solution Approach 2:
The mounting tool separates the holder from the holding surface, allowing the holder to be independently positioned at different locations. This segmentation enables the same simple tool structure to achieve precise mounting for various component sizes through positional adjustment.
3Device complexity
If traditional mounting methods are used without negative pressure ventilation paths, then device complexity is reduced, but air bubbles remain between components and substrate causing poor connection
Solution Approach 1:
The mounting tool incorporates ventilation paths that use negative pressure (vacuum) to actively remove air bubbles between the electronic component and substrate during mounting. This pneumatic mechanism ensures reliable connection by eliminating air bubbles without significantly increasing device complexity.
Solution Approach 2:
The ventilation paths act as an intermediary mechanism between the holder and the component-substrate interface, using negative pressure to mediate the removal of air bubbles. This intermediary function improves connection reliability while keeping the overall device structure relatively simple.
4Reliability
If negative pressure ventilation paths are added to remove air bubbles, then connection strength is improved, but device complexity increases
Solution Approach 1:
The ventilation paths use a negative pressure generation device to create suction that removes air bubbles. This pneumatic approach achieves reliable mounting connections through a relatively simple mechanism compared to mechanical alternatives, balancing connection strength and device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tool can be used for electronic components of various sizes without shape changes, effectively reducing air bubbles and improving connection strength by deforming the component to match the substrate, thus preventing mounting failures.
Implementation Method 1
a first ventilation path configured to communicate with the first opening and to suck and hold the electronic component at the holding surface by creating negative internal pressure
Implementation Method 2
a second ventilation path configured to communicate with the second opening and to suck the overhang portion of the electronic component facing the opposing surface by creating negative internal pressure
Data Source
AI summary
According to one embodiment, a mounting tool and a mounting apparatus that can be used for the electronic components with different sizes without changing a shape thereof and can reduce remaining air bubbles when mounting the electronic component on the substrate are provided. A mounting tool 31 of the embodiment includes: a holder 311 including a holding surface 311a configured to hold an inner side of the electronic component 2 inside a pair of opposite outer edges of the electronic component 2; an expanded portion 312 including an opposing surface that is facing away from an overhang portion 2c of the electronic component 2 that protrudes outward than the outer edge of the holding surface 311a of the holder 311 and is not held by the holder 311; a first opening 313 provided in the holding surface 311a; a second opening 315 provided in the opposing surface 312a; a first ventilation path 314 configured to communicate with the first opening 313 and to suck and hold the electronic component 2 at the holding surface 311a by creating negative internal pressure; and a second ventilation path 316 that sucks the overhang portion 2c of the electronic component 2 facing the opposing surface 312a by creating negative internal pressure.