Miniaturized Vacuum Package with Embedded Routing
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Solution Overview
Problem
Surface ion trap detectors face challenges in maximizing signal coupling while minimizing size, particularly in achieving efficient electrical and optical signal transfer within a controlled vacuum environment, which is essential for applications in dynamic environments like battlefields or satellite platforms.
Innovation Solution
An integrated package with embedded electrical and optical routing circuits and a vacuum vessel that forms a chamber above the active area, allowing for simplified bonding and hermetic sealing, thereby providing controlled access to the active area without breaking the vacuum environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the vacuum vessel is bonded directly to the substrate with exposed routing circuits, then bonding complexity increases, but signal coupling efficiency improves
Solution Approach 1:
The electrical and optical routing circuits are embedded within the substrate rather than being exposed on the surface. This merging of the circuits into the substrate structure simplifies the bonding process between the vacuum vessel and substrate, while maintaining efficient signal coupling to the active area through the integrated routing paths.
2Volume of moving object
If the package size is minimized for dynamic applications, then SWaP performance improves, but signal collection efficiency deteriorates
Solution Approach 1:
The routing circuits are arranged in a three-dimensional configuration within the substrate, utilizing vertical and lateral pathways to route signals from the active area to external connections. This dimensional optimization allows compact packaging while maintaining adequate signal collection efficiency through optimized path lengths and coupling geometries.
3Manufacturing precision
If the active area is isolated from bonding material during sealing, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
The substrate surface is segmented into distinct functional regions: an active area for sensing/detection, a routing circuit region with embedded circuits, and a peripheral bonding region. This segmentation allows bonding material to be confined to specific areas away from the active area, preventing contamination while maintaining manufacturing simplicity through clear zone definition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances signal collection efficiency, reduces mechanical constraints, and maintains ultra-high vacuum performance, making it suitable for miniaturized, dynamic applications by integrating the vacuum vessel with the active area, thus improving size, weight, and power (SWaP) performance.
Implementation Method 1
maintains ultra-high vacuum performance
Data Source
AI summary
The present disclosure relates to an integrated package having an active area, an electrical routing circuit, an optical routing circuit, and a vacuum vessel. Methods of making such a package are also described herein.