Vacuum Pipe Assembly Control for Uniform Substrate Processing
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Solution Overview
Problem
The flow of fluid suctioned into vacuum pumps during semiconductor processing affects process uniformity in high vacuum chambers, impacting the quality of semiconductor devices.
Innovation Solution
A substrate processing apparatus with a pipe assembly featuring a first pipe and multiple second pipes, each with individual control valves, allows for precise regulation of gas flow to maintain uniform pressure and improve process uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single vacuum pump is used to provide negative pressure to the chamber, then the device complexity is reduced, but the process uniformity deteriorates due to non-uniform fluid flow distribution
Solution Approach 1:
The vacuum pump system is segmented into multiple suction ports (first suction port and second suction port) with separate control valves (first valve and second valve). This allows independent control of fluid flow at different locations, enabling uniform process conditions across the substrate while maintaining manageable system complexity through modular architecture.
Solution Approach 2:
Different regions of the chamber are provided with different suction characteristics through the first and second suction ports. The first suction port is positioned to handle fluid flow from the central region, while the second suction port handles fluid flow from the peripheral region. This local differentiation ensures uniform pressure distribution and process uniformity across different areas of the substrate.
2Manufacturing precision
If multiple pipes and valves are added to improve fluid flow distribution, then the process uniformity is improved, but the device complexity increases
Solution Approach 1:
The pipe assembly is segmented into a first pipe connected to the first suction port and a second pipe connected to the second suction port. Each pipe has its own control valve, allowing independent regulation of fluid flow from different chamber regions. This segmentation achieves uniform process conditions while keeping the overall system complexity manageable through clear functional separation.
Solution Approach 2:
The control valves on the first and second pipes are made adjustable, allowing dynamic control of fluid flow distribution. This enables the system to adapt to different process requirements and maintain optimal uniformity under varying conditions, while the modular valve-and-pipe structure prevents complexity from becoming unmanageable.
3Manufacturing precision
If individual valve control is implemented on multiple pipes, then the process uniformity is improved through precise flow regulation, but the ease of operation deteriorates due to increased control complexity
Solution Approach 1:
The system incorporates sensors to detect pressure or flow conditions and feeds this information back to the control system. Based on the detected conditions, the control system automatically adjusts the opening degrees of the first and second valves to maintain uniform process conditions. This feedback mechanism achieves high process uniformity while reducing the operational burden on the user.
Solution Approach 2:
The control system automatically regulates the first and second valves based on real-time process conditions without requiring manual intervention. The system self-adjusts to maintain optimal fluid flow distribution and process uniformity, eliminating the need for operators to manually coordinate multiple valve controls and thereby improving ease of operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enhances process uniformity by individually controlling the opening and closing of valves, ensuring consistent etching or deposition processes across the substrate.
Implementation Method 1
a vacuum pump connected to the chamber and configured to provide negative pressure to the chamber
Implementation Method 2
a flow of fluid suctioned into the vacuum pump may affect the process uniformity
Data Source
AI summary
A substrate processing apparatus includes a chamber, a stage in the chamber and configured to accommodate a substrate, a vacuum pump connected to the chamber and configured to provide negative pressure to the chamber, and a controller, where the vacuum pump includes a pipe assembly connected to the chamber, the pipe assembly including a first pipe, at least one second pipe, a common pipe connected to the first pipe and the at least one second pipe, a first valve provided on the first pipe, and at least one second valve provided on the at least one second pipe, an intake port connected to the pipe assembly, and a pump connected to the intake port and configured to provide negative pressure.