Vacuum Processing Device Temperature Correction Unit
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Solution Overview
Problem
Conventional vacuum processing devices face challenges in achieving in-plane temperature uniformity of substrates due to the quartz window obstructing infrared lamp placement, leading to increased chamber size and difficulty in reducing the device's footprint.
Innovation Solution
A vacuum processing device with a temperature correction unit, such as a ring-like heat storage member made of SiC, is positioned between the substrate and the cooling unit to correct temperature differences between the central and peripheral areas of the substrate during heating, while a correction unit moving device retracts the temperature correction unit to minimize footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large heating lamp is used to uniformly irradiate the entire surface of the substrate, then the in-plane temperature uniformity is improved, but the size of the vacuum chamber increases
Solution Approach 1:
The heating system is segmented into a main heating lamp and a temperature correction unit with multiple infrared light sources arranged in a matrix pattern. The correction unit is divided into multiple independent light sources that can be individually controlled to address temperature non-uniformity in different regions of the substrate, eliminating the need for a single large heating lamp.
Solution Approach 2:
The temperature correction unit applies localized heating to specific regions of the substrate that exhibit temperature non-uniformity. By arranging infrared light sources in a matrix pattern and positioning them to face the rear surface of the substrate, the system provides targeted temperature correction without requiring uniform illumination across the entire substrate area.
2Temperature
If the temperature correction unit is positioned between the substrate and cooling unit, then temperature uniformity is improved, but the space utilization is reduced
Solution Approach 1:
The temperature correction unit is designed to be movable rather than fixed. It can be positioned between the substrate and cooling unit during the heating process to correct temperature non-uniformity, and then retracted or moved away when not needed, allowing the space to be utilized for other purposes such as substrate loading or cooling operations.
Solution Approach 2:
The temperature correction unit operates periodically rather than continuously. It is activated during specific phases of the processing cycle when temperature correction is needed, and retracted during other phases, optimizing space utilization while maintaining temperature uniformity when required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains temperature uniformity across the substrate while reducing the device's footprint, enhancing processing efficiency and throughput by preventing temperature drops and improving heat distribution.
Implementation Method 1
an infrared lamp arranged above a substrate supported in a vacuum chamber with a quartz window being interposed between them
Implementation Method 2
a vertically movable cooling member arranged below the substrate, and performs a heating/cooling process by bringing the heated substrate into tight contact with the cooling member
Implementation Method 3
a temperature correction unit configured to correct a temperature of a periphery of the substrate in order to reduce a temperature difference between a central portion and the periphery of the substrate by being arranged in a predetermined position between the substrate supported by the substrate supporting unit and the cooling unit
Data Source
AI summary
A vacuum processing apparatus according to this invention includes a heating unit arranged to face a processing surface of a substrate supported by a substrate support unit in a vacuum chamber, a cooling unit arranged to face a reverse surface of the substrate supported by the substrate support unit, a temperature correction unit configured to correct a temperature of a periphery of the substrate in order to reduce a temperature difference between a central portion and the periphery of the substrate by being arranged in a predetermined position between the substrate and the cooling unit when the heating unit heats the substrate, and a correction unit moving device configured to retract the temperature correction unit from the predetermined position.