Vacuum Processing System with Dual Transfer Devices
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Solution Overview
Problem
Conventional processing systems face challenges in achieving high throughput and miniaturization when using multi-reactor type vacuum process chambers due to limitations in wafer transfer capacity and the need for mechanisms like rotating substrate mounting tables, which hinder efficient loading and unloading of wafers and increase system size.
Innovation Solution
A compact processing system design featuring multiple multi-reactor type vacuum process chambers connected via a common vacuum transfer device, with atmospheric-pressure transfer devices and vacuumable load lock chambers, allowing simultaneous processing of multiple wafers without the need for rotating substrate mounting tables, and utilizing first and second common transfer devices connected perpendicularly to facilitate efficient wafer transfer and reduce system size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional vacuum transfer device is used with multi-reactor type vacuum process chambers, then the number of wafers that can be transferred at one time is limited, but this requires a longer period for loading and unloading wafers, reducing throughput
Solution Approach 1:
The vacuum transfer device is divided into multiple transfer chambers (first vacuum transfer chamber and second vacuum transfer chamber) that can operate simultaneously. This segmentation allows parallel transfer operations, increasing the number of wafers transferred per unit time and improving throughput without extending loading/unloading periods.
Solution Approach 2:
The substrate mounting table is designed to rotate vertically (changing the dimension of rotation from horizontal to vertical), enabling wafers to be transferred from both the front surface and rear surface of the table simultaneously. This dimensional change allows dual-sided loading and unloading operations to occur in parallel, dramatically increasing transfer capacity.
2Ease of operation
If a mechanism for rotating the substrate mounting table is installed in the vacuum process chamber to load and unload all wafers, then wafer transfer is enabled, but the vacuum process chamber size increases, preventing miniaturization
Solution Approach 1:
The substrate mounting table rotates in the vertical direction rather than horizontally, allowing wafers to be accessed from both front and rear surfaces. This vertical rotation enables complete wafer loading and unloading without requiring additional horizontal space or complex mechanisms inside the vacuum process chamber, maintaining compact dimensions.
Solution Approach 2:
The vacuum transfer device acts as an intermediary mechanism located outside the vacuum process chamber, performing the complex wafer transfer operations. This externalizes the transfer mechanism, eliminating the need for space-consuming rotating tables or transfer mechanisms inside the vacuum process chamber while maintaining ease of operation.
3Productivity
If the vacuum transfer device transfers a number of wafers that can be collectively processed in a multi-reactor type vacuum process chamber at one time, then throughput is improved, but the transfer device complexity increases
Solution Approach 1:
The vacuum transfer device is segmented into multiple independent transfer chambers and transfer arms that can operate autonomously. This segmentation allows the system to handle multiple wafers simultaneously through parallel operations of simpler modular units, achieving high throughput without requiring a single complex transfer mechanism.
Solution Approach 2:
The substrate mounting table serves multiple functions: it holds wafers for processing, rotates vertically to present wafers to different transfer chambers, and enables both loading and unloading operations. This multi-functionality reduces the need for separate specialized mechanisms, simplifying the overall device while maintaining high throughput capability.
Data Source
AI summary
A system includes a transfer device for transferring workpieces in an atmospheric atmosphere, a transfer unit for transferring the workpieces in a vacuum atmosphere, and a vacuum processing unit including vacuum process chambers connected to the transfer unit and for performing a process on the workpieces in each process chamber. The vacuum processing unit simultaneously performs the process on the workpieces in each process chamber. The process chambers are arranged along a first direction. The transfer unit includes first and second common transfer devices installed along the first direction to transfer the workpieces along the first direction. The first common transfer device is connected to each process chamber at a first side in a second direction perpendicular to the first direction, the second common transfer device is connected to each process chamber at a second side in the second direction.