Vacuum Processing Apparatus Scheduling for Semiconductor Wafer Throughput
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Solution Overview
Problem
Existing vacuum processing apparatuses for semiconductor wafers face inefficiencies due to waiting times and uncertain process times, leading to reduced throughput and productivity, as they lack advanced scheduling mechanisms to manage the transfer and processing of multiple wafers simultaneously.
Innovation Solution
A vacuum processing apparatus with a controller that schedules operations based on pre-determined schedules, adjusting for stagnation times and optimizing the sequence of sample transfer between lock chambers and processing chambers to minimize total process time, using a multi-chamber system with atmospheric and vacuumized transfer units to enhance transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a shared transfer system is used for multiple process units, then device complexity is reduced, but productivity decreases due to waiting times and sequential transfer operations
Solution Approach 1:
The transfer system is segmented into multiple independent transfer units (first transfer unit and second transfer unit), each capable of independent operation. This allows parallel transfer operations between different process units, eliminating the bottleneck of sequential transfers and reducing waiting times while maintaining manageable system complexity through modular architecture.
2Device complexity
If sequential transfer operations are performed in the transfer unit, then device complexity is reduced, but loss of time increases due to waiting periods between transfers
Solution Approach 1:
The controller performs preliminary scheduling of transfer operations, determining optimal transfer sequences and timing in advance. By pre-planning transfer operations and coordinating multiple transfer units, the system eliminates idle waiting periods and ensures continuous operation, reducing time loss without requiring complex real-time decision-making mechanisms.
3Productivity
If multiple wafers are processed simultaneously in parallel, then productivity increases, but device complexity increases due to coordination requirements
Solution Approach 1:
Multiple transfer units are designed with identical, standardized interfaces and control protocols, allowing them to function interchangeably and be coordinated through a universal control framework. This multi-functionality enables parallel wafer processing while keeping coordination complexity manageable through standardized procedures rather than custom control logic for each transfer unit.
4Ease of operation
If uncertain process times are accommodated without scheduling, then ease of operation is maintained, but productivity decreases due to inefficient resource utilization
Solution Approach 1:
The controller implements feedback mechanisms that monitor actual process times and transfer operation status in real-time. Based on this feedback, the controller dynamically adjusts transfer scheduling and coordinates transfer units to optimize resource utilization. This maintains operational flexibility while improving productivity through data-driven decision-making rather than rigid predetermined schedules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces waiting times and improves throughput by synchronizing operations, allowing for more efficient processing of multiple wafers, resulting in increased productivity and stable throughput.
Implementation Method 1
a vacuumized transfer unit (141) having its periphery connected with the vacuum containers (101a to 101d) and having in its interior a transfer chamber (141c) which is reduced in pressure and through which the sample is transferred
Implementation Method 2
a plasma generation unit and is used to process a substrate-like sample such as a semiconductor wafer (hereinafter referred to as a wafer) by using a plasma generated in the processing chamber
Data Source
AI summary
A vacuum processing apparatus includes a plurality of vacuum containers; a vacuumized transfer unit connected with the vacuum containers and having a transfer chamber; a plurality of lock chambers connected to the vacuumized transfer unit; a vacuumized transferring section arranged in the transfer chamber to transfer the sample between each of the lock chambers and each of the processing chambers inside the plurality of vacuum containers; an atmospheric transfer container having a space through which the sample is transferred under the atmospheric pressure; an atmospheric transfer unit arranged in the atmospheric transfer container and adapted to transfer the sample from a cassette; and a controller operative on the basis of schedule information of a plurality of operations to adjust the operations, the information including times of stagnation of the plurality of samples and set therefor.