Vacuum Pump Cleaning Flow for Semiconductor Exhaust Byproduct Removal
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Solution Overview
Problem
Existing systems for treating exhaust fluid from semiconductor manufacturing equipment are inefficient in removing process byproducts like SiO2 powder from both the booster and dry pumps due to non-plasma discharge-treated cleaning gases and the large inner area and long flow path of multi-stage dry pumps, leading to reduced removal efficiency and shortened pump lifespan.
Innovation Solution
A system and method where cleaning gases decomposed by a plasma apparatus alternately flow to a front rotor region and a rear rotor region of the booster pump, then to a dry pump, with adjustable motor rotational speed to increase retention time and uniform distribution of cleaning gases, ensuring thorough reaction with process byproducts throughout the vacuum pump.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If cleaning gases are supplied to the vacuum pump without plasma discharge treatment, then the system design is simple, but the removal efficiency of process byproducts is insufficient
Solution Approach 1:
The cleaning gases undergo plasma discharge treatment in advance before being supplied to the vacuum pump. This preliminary action activates the cleaning gases, enhancing their reactivity and removal efficiency for process byproducts like SiO2 powder, while maintaining relatively simple system design
Solution Approach 2:
The plasma discharge treatment changes the physical and chemical parameters of the cleaning gases, transforming them from inactive to active state. This parameter change enables the cleaning gases to effectively remove process byproducts without requiring complex additional treatment systems
2Quantity of substance
If the dry pump has a large inner area and long flow path, then the pump capacity is sufficient, but the retention time of cleaning gases is insufficient leading to reduced removal efficiency
Solution Approach 1:
The motor rotational speed is made adjustable to dynamically control the pump operation. By adjusting the speed, the system optimizes the balance between pump capacity and retention time, ensuring sufficient contact time between activated cleaning gases and process byproducts for effective removal
Solution Approach 2:
The motor rotational speed parameter is changed to control the flow characteristics and retention time. This parameter adjustment allows the system to maintain sufficient pump capacity while ensuring adequate retention time for the cleaning gases to react with and remove process byproducts
3Productivity
If the motor rotational speed is increased, then the pump capacity increases, but the retention time of cleaning gases decreases reducing reaction efficiency
Solution Approach 1:
The motor rotational speed is made dynamically adjustable rather than fixed. This allows the system to optimize the balance between pump capacity and retention time based on operational requirements, ensuring both efficient pumping and sufficient reaction time for byproduct removal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the removal efficiency of process byproducts by ensuring uniform distribution and increased reaction time, extending the lifespan of vacuum pumps and preventing corrosion, while simplifying the system design and reducing power consumption.
Implementation Method 1
cleaning gases decomposed by a plasma apparatus
Data Source
AI summary
Disclosed is a system for treating exhaust fluid from semiconductor manufacturing equipment in which cleaning gases decomposed by a plastic apparatus alternately flow towards a front rotor region (a main rotor unit) and a rear rotor region (a subsidiary rotor unit) of a booster pump and then flow towards a dry pump, and thus uniformly react with process byproducts present throughout the whole area in a vacuum pump including the booster pump and the dry pump so as to improve removal efficiency of the process byproducts. Further, the retention time of the cleaning gases decomposed by the plasma apparatus in the vacuum pump is increased by adjusting the pressure in the pump with the rotational speed of a motor, and thus the reaction time of the cleaning gases with the process byproducts is increased, so as to further improve removal efficiency of the process byproducts, such as SiO2 powder.