Vacuum Pump Control Device Heat Dissipation and Noise Reduction

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Solution Overview

Problem

Conventional vacuum pump control apparatuses face issues with noise resistance and heat radiation characteristics due to a complex configuration with numerous circuit boards, harnesses, and connectors, leading to increased costs and assembly complexity, as well as potential noise degradation.

Innovation Solution

A vacuum pump control apparatus with a simplified configuration featuring a housing with an open upper side, a heat radiating plate, and a board fixing mechanism that includes a mounting hole and screwing means to securely attach the second circuit board, reducing the number of components and improving heat radiation efficiency by utilizing aluminum for the housing and forming a protruded board mounting seat portion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple circuit boards are arranged in a stepped manner inside the housing, then the control circuit functionality is achieved, but the number of parts (harnesses and connectors) increases and assembly workability deteriorates

Engineering Contradiction:
Improvecontrol circuit functionalityVSAvoidnumber of parts
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges multiple circuit boards into a single integrated circuit board structure. Instead of arranging multiple separate circuit boards (206a-206f) in a stepped manner with numerous connectors and harnesses, the invention integrates all control circuit functions onto one circuit board, thereby eliminating the need for multiple connectors and harnesses while maintaining full control functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The single circuit board is designed to perform multiple functions that were previously distributed across multiple separate circuit boards. The circuit board includes various mounting portions for different control components, allowing one universal board to replace multiple specialized boards, thus reducing the overall number of parts while achieving the same control capabilities.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple circuit boards are arranged in a stepped manner inside the housing, then the control circuit functionality is achieved, but assembly workability deteriorates

Engineering Contradiction:
Improvecontrol circuit functionalityVSAvoidassembly workability
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

By combining multiple circuit boards into one integrated board, the patent simplifies the assembly process. Instead of requiring precise stepped arrangement and connection of multiple separate boards with numerous connectors, the single board design allows for simpler mounting procedures and reduces assembly complexity, thereby improving assembly workability while maintaining control functionality.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If harnesses and connectors are used to connect circuit boards, then electrical connectivity is achieved, but noise resistance deteriorates due to noise intrusion

Engineering Contradiction:
Improveelectrical connectivityVSAvoidnoise resistance
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent extracts and eliminates the harnesses and connectors from the system by integrating all electrical connections onto a single circuit board. This removal of external connection components eliminates the pathways through which noise could intrude into the control circuit, thereby improving noise resistance while maintaining necessary electrical connectivity through integrated traces and connections on the single board.

Inventive Principle:
Principle #2Taking out (Extraction)

4Temperature

If circuit boards are cooled by radiating heat through the housing, then heat dissipation is achieved, but heat radiation efficiency is insufficient

Engineering Contradiction:
Improveheat dissipationVSAvoidheat radiation efficiency
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The patent introduces a heat radiating plate as an intermediary component between the circuit board and the housing. This heat radiating plate serves as a thermal mediator that enhances heat transfer from the circuit board to the housing, improving heat radiation efficiency. The plate provides a larger surface area and better thermal contact, allowing more effective passive cooling without requiring additional active cooling systems.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances noise resistance and heat radiation characteristics by reducing the number of circuit boards, harnesses, and connectors, improving assembly workability and heat transfer efficiency, resulting in a more efficient and reliable vacuum pump control apparatus.

Implementation Method 1

a heat radiating plate 203 which enables heat radiation of the first circuit board 206a

Methodology Applied
Scientific EffectHeat radiation: Thermal Radiation

Implementation Method 2

a board fixing means 51 which fixes the second circuit board 42 to an inner surface of the housing 22 so as to enable heat radiation

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentEP3536964B1Vacuum pump control device, vacuum pump, and method for assembling vacuum pump control device
Publication Date: 2022.08.17 EDWARDS JAPAN
  • EP3536964B1 patent drawingFigure 1
  • EP3536964B1 patent drawingFigure 2
  • EP3536964B1 patent drawingFigure 3

AI summary

To provide a vacuum pump control apparatus with a simple configuration which is resistant to noise and which is capable of improving heat radiation characteristics with respect to a circuit board, a vacuum pump including the vacuum pump control apparatus, and an assembly method of the vacuum pump control apparatus. The vacuum pump control apparatus includes: a plurality of circuit boards 40 including a first circuit board 41 and a second circuit board 42 which constitute a control circuit that controls a vacuum pump main body; a housing 22 having an internal space 30 in which the plurality of the circuit boards 40 are arranged, in which an upper side of the housing is open; a heat radiating plate 23 having a bottom surface portion 26 to which the first circuit board 41 is mounted so as to enable heat radiation and which is arranged on the housing 22 so as to close the opening of the housing 22; and a board fixing means 51 which fixes the second circuit board 42 to a board mounting seat portion 32 of the housing 22 so as to enable heat radiation.