Vacuum Pump Cooling Surface Dew Condensation Prevention

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Solution Overview

Problem

In power source integrated vacuum pumps, dew condensation occurs on the cooling surface due to exposed regions reaching a lower temperature than the dew point, leading to inefficiencies and potential damage.

Innovation Solution

A heat insulating member with a smaller coefficient of thermal conductivity than the cooling surface material is used to cover uncovered regions of the cooling surface, reducing contact area and preventing dew condensation, while allowing optional circuit substrates for temperature adjustment and easy installation/removal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If substrates are fixed on the cooling surface for intensive cooling, then cooling efficiency is improved, but exposed regions on the cooling surface reach lower temperatures causing dew condensation

Engineering Contradiction:

Improvecooling surface temperatureVSAvoiddew condensation prevention

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent applies different materials to different regions of the cooling surface: substrates with high thermal conductivity materials in regions requiring intensive cooling, and heat insulating members with low thermal conductivity materials in exposed regions. This local differentiation allows the cooled regions to maintain low temperatures for cooling efficiency while the exposed regions maintain higher temperatures to prevent dew condensation.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

Heat insulating members are introduced as intermediary components between the cooling surface and the external environment in exposed regions. These members mediate the thermal interaction, preventing direct heat transfer from the cold cooling surface to the warmer external air, thereby preventing dew condensation while allowing the cooling surface itself to remain cold for effective cooling of mounted substrates.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Device complexity

If the power source device has a semi-closed structure, then device simplicity is improved, but dew point temperature equals external air temperature leading to dew condensation on exposed cooling regions

Engineering Contradiction:

Improvepower source device structureVSAvoiddew condensation prevention

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

Instead of changing the overall semi-closed structure of the power source device, the patent applies local quality modification by attaching heat insulating members specifically to exposed regions of the cooling surface. This maintains the simple semi-closed structure while locally addressing the dew condensation problem in exposed areas.

Inventive Principle:

Principle #3Local quality

3Reliability

If heat insulating members are used to cover exposed cooling regions, then dew condensation is prevented, but device complexity increases

Engineering Contradiction:

Improvedew condensation preventionVSAvoidcooling device structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The heat insulating members are designed as detachable, replaceable components that can be easily installed and removed. This approach treats them as simple, inexpensive add-on elements rather than integrated permanent structures, minimizing the increase in device complexity while effectively preventing dew condensation.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents dew condensation on the cooling surface, maintains higher surface temperatures of the heat insulating members, and allows for flexible circuit configurations, enhancing the pump's operational reliability and efficiency.

Implementation Method 1

a heat insulating member having a smaller coefficient of thermal conductivity than that of a material forming the cooling surface and covering a cooling surface region to which the substrate is not fixed

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

a cooling jacket configured such that refrigerant circulates in the cooling jacket and arranged between the pump main body and the pump power source device, and the cooling surface is formed at a pump power source device side surface of the cooling jacket

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10941787B2Power source integrated vacuum pump having a power source with a substrate in contact with and covering a portion of a cooling surface which is also covered by a heat insulating plate

Publication Date: 2021.03.09 SHIMADZU CORP

AI summary

A power source integrated vacuum pump configured such that a pump main body and a pump power source device are integrated together, comprises: a substrate which is provided at the pump power source device and on which an electronic component is mounted; a cooling device having a cooling surface fixed in contact with the substrate; and a heat insulating member having a smaller coefficient of thermal conductivity than that of a material forming the cooling surface and covering a cooling surface region to which the substrate is not fixed.