Turbo-Molecular Vacuum Pump Thermal Insulation Design
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Solution Overview
Problem
Turbo-molecular pumps face challenges in rapidly increasing the temperature of the pump main body to a desired level due to heat transfer issues between the pump main body and the water-cooling device, despite the use of heat insulating plates.
Innovation Solution
The implementation of a vacuum pump design that includes a heater at the pump main body, a power source device, a cooler between the pump main body and the power source device, a connection plate, and strategically placed first and second heat insulating plates, where the heat insulating plates are fitted into specific regions and clearances to minimize heat transfer, with the first heat insulating plate being thinner and wider than the clearance, and the second heat insulating plate being thicker and wider than the clearance, effectively reducing heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat insulating plate is provided between the connection plate and the water-cooling device, then heat transfer between the pump main body and the water-cooling device is reduced, but the temperature of the pump main body still cannot increase to the desired temperature in short time
Solution Approach 1:
The heat insulating structure is divided into multiple segments: a first heat insulating plate between the connection plate and cooler, and a second heat insulating plate between the pump main body and connection plate. This segmentation creates multiple thermal barriers in series, significantly reducing heat transfer from the cooler to the pump main body, thereby enabling faster temperature increase when the heater operates.
Solution Approach 2:
Heat insulating plates are introduced as intermediary elements between the cooler and the pump main body. These intermediaries block the direct thermal conduction path, preventing the cooler from extracting heat from the pump main body, thus allowing the heater to rapidly increase the pump main body temperature without significant heat loss to the cooler.
2Loss of energy
If the thickness of heat insulating plates is increased to reduce heat transfer, then heat insulation performance is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
Instead of using a single thick heat insulating plate, the insulation is segmented into two thinner plates positioned at different locations. This segmentation achieves equivalent or superior thermal insulation performance while reducing manufacturing complexity, as thinner plates are easier to manufacture, handle, and install than a single thick plate.
Solution Approach 2:
Heat insulating plates are strategically positioned at specific locations where heat transfer paths exist: one between the connection plate and cooler, and another between the pump main body and connection plate. This local application of insulation targets the most critical heat transfer zones, achieving effective thermal isolation without unnecessarily increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for the rapid increase of the pump main body temperature to a desired level by minimizing heat transfer through air heat insulating layers, thereby enhancing the pump's performance.
Implementation Method 1
a first heat insulating plate arranged between the cooler and the connection plate
Implementation Method 2
a second heat insulating plate arranged between the pump main body and the connection plate
Implementation Method 3
a heater provided at the pump main body
Implementation Method 4
a cooler provided between the pump main body and the power source device
Data Source
AI summary
A vacuum pump comprises: a pump main body; a heater provided at the pump main body; a power source device configured to supply power to the pump main body; a cooler provided between the pump main body and the power source device; a connection plate provided between the pump main body and the cooler; a first heat insulating plate arranged between the cooler and the connection plate; and a second heat insulating plate arranged between the pump main body and the connection plate.