Vacuum Processing Device Dynamic Pump Output Control
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Solution Overview
Problem
Conventional vacuum reflow devices face challenges in efficiently evacuating chambers to a target vacuum state, leading to prolonged evacuation times and increased scattering of flux, components, and solder due to fixed pump outputs, which results in voids and reduced production efficiency.
Innovation Solution
A vacuum-processing device with a control method that dynamically switches pump outputs based on the rate of vacuum pressure decrease, initially using a lower output and escalating to higher outputs when the pressure decrease slows, allowing for more selective evacuation and quicker attainment of the target vacuum state.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a fixed pump output is used for vacuum evacuation, then the evacuation process is simple to control, but the evacuation time is prolonged and production efficiency is reduced
Solution Approach 1:
The pump output is dynamically adjusted during the evacuation process based on the real-time vacuum degree. The control section switches between multiple pump outputs (first pump output for initial evacuation, second pump output for final evacuation) according to the measured vacuum level, transforming the static fixed-output system into a dynamic adaptive system that optimizes evacuation speed at different stages.
Solution Approach 2:
The system changes the operational parameters of the vacuum pump by selecting different pump outputs based on the vacuum degree. When the vacuum degree reaches a predetermined threshold, the control section switches from the first pump output to the second pump output, thereby adapting the evacuation rate to the current vacuum state and reducing total evacuation time.
2Productivity
If a high pump output is used throughout evacuation, then the evacuation time is shortened, but flux, components, and solder scatter excessively
Solution Approach 1:
The system dynamically adjusts pump output based on vacuum degree to prevent excessive scattering. By starting with a lower first pump output during initial evacuation and switching to a higher second pump output only when vacuum degree reaches the threshold, the system achieves fast evacuation while minimizing flux and solder scattering that would occur with continuously high pump output.
Solution Approach 2:
The evacuation process is divided into two periodic stages: the first stage uses the first pump output for initial evacuation, and when the vacuum degree reaches the predetermined value, the system transitions to the second stage using the second pump output for final evacuation. This periodic switching of pump outputs optimizes both evacuation speed and material stability.
3Object-generated harmful factors
If a low pump output is used throughout evacuation, then flux and solder scattering is minimized, but the evacuation time is prolonged
Solution Approach 1:
The system uses a dynamic pump output adjustment strategy rather than a fixed low output. It starts with the first pump output (lower) to minimize scattering during initial evacuation, then switches to the second pump output (higher) when vacuum degree reaches the threshold, thereby achieving both low scattering and reduced evacuation time.
Solution Approach 2:
The system performs preliminary evacuation using the first pump output to reach a predetermined vacuum degree before switching to the second pump output. This preliminary action phase prepares the system for the final evacuation stage, ensuring that flux and solder are stabilized before applying higher pump output.
4Productivity
If the pump output is switched dynamically based on vacuum degree, then evacuation time is reduced and scattering is minimized, but the control system becomes more complex
Solution Approach 1:
The control section continuously monitors the vacuum degree and uses this feedback to determine when to switch between pump outputs. When the vacuum degree reaches the predetermined value, the system automatically switches from the first to the second pump output, creating a closed-loop control system that optimizes evacuation without requiring complex manual intervention.
Solution Approach 2:
The control system automatically manages the pump output switching based on vacuum degree measurements, making the system self-regulating. The control section independently decides when to transition between pump outputs without external intervention, simplifying operation while achieving optimized evacuation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces evacuation time, minimizes void formation, and prevents scattering of flux and solder, enhancing the quality and efficiency of vacuum soldering processes.
Implementation Method 1
the vacuum evacuation pump operates to create the vacuum state
Implementation Method 2
the defoaming and/or deaerating effect removes the voids remained in the solder during solder melting
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
The invention enables quick evacuation of a chamber to a specified target degree of vacuum while increasing selectivity of evacuation conditions. A vacuum-processing device contains a chamber 40 that enables a workpiece to be soldered in a vacuum environment, an operating part 20 that sets a condition for evacuating the chamber 40, a pump 23 that evacuates the chamber 40, and a control portion 61 that calculates the amount of decrease in the degree of vacuum when evacuating the chamber 40 using a predetermined pump output, sets the calculated value as a reference value and switches an evacuation property from the evacuation property including a lower pump output to the evacuation property including a higher pump output when the calculated amount of decrease in degree of vacuum in real time has become smaller than the reference value.