Vacuum Pump Substrate Cooling and Wiring via Plate Pins
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing vacuum pumps face challenges in simplifying wiring and cooling between substrates, leading to increased costs and potential electronic element failure due to heat accumulation and corrosion, especially when electrolytic capacitors burst in vacuum environments.
Innovation Solution
The integration of a single plate between the vacuum pump main unit and control unit using pins to connect substrates, with one substrate in the vacuum and the other in air, allows for simplified configuration, reduced wiring, and simultaneous cooling through a water-cooling pipe, eliminating the need for expensive connectors and solder cups.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the control substrate is arranged on the vacuum side to simplify wiring, then the number of pins of connector plugs is reduced, but electrolytic capacitors may burst and electrolyte may leak
Solution Approach 1:
The patent divides the system into two separate substrates: a first substrate (control substrate) arranged in the vacuum atmosphere and a second substrate (power supply substrate) arranged in the air atmosphere. This segmentation allows electrolytic capacitors to be placed on the second substrate where they are not exposed to vacuum, eliminating the risk of bursting while keeping the control substrate in vacuum for simplified wiring.
Solution Approach 2:
The patent introduces a plate with pins as an intermediary structure that connects both substrates. The pins penetrate the plate and are exposed from both surfaces, allowing electrical connection between the first substrate (in vacuum) and the second substrate (in air) without requiring complex connector plugs, thus simplifying wiring while maintaining reliability.
2Device complexity
If electronic elements generating heat are arranged in the vacuum atmosphere, then wiring is simplified, but heat accumulates since heat is conducted only through radiation
Solution Approach 1:
The patent separates heat-generating electronic elements (electrolytic capacitors) from the vacuum atmosphere by placing them on the second substrate in the air atmosphere. This segmentation prevents heat accumulation in the vacuum environment while maintaining simplified wiring through the pin-connected plate structure.
3Reliability
If the substrate is molded to have resistance to corrosion from corrosive gases, then durability in vacuum environment is improved, but heat accumulation occurs leading to anomalous heating of electronic elements
Solution Approach 1:
The patent segments electronic elements into two groups: those requiring corrosion resistance (placed on the first substrate in vacuum) and those generating significant heat (placed on the second substrate in air). This segmentation allows the substrate in vacuum to be molded for corrosion resistance without causing heat accumulation, while heat-generating elements are positioned in the air environment where heat dissipation is more effective.
4Reliability
If connectors with vacuum sealing structure are used to integrate pump main unit and control device, then airtightness is achieved, but production cost increases due to required solder cups
Solution Approach 1:
The patent uses a plate with pins as an intermediary connection structure between the pump main unit and control device. The pins penetrate the plate and provide both electrical connection and structural integration, eliminating the need for complex connector plugs with solder cups while maintaining vacuum sealing through the plate's integration with the pump housing.
Solution Approach 2:
The patent extracts the complex connector plug mechanism (including solder cups and vacuum sealing structures) from the system and replaces it with a simpler plate-and-pins structure. This extraction simplifies manufacturing by eliminating expensive components while maintaining the necessary airtightness through the integrated plate design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies the vacuum pump's structure, reduces production costs, and effectively cools both substrates while preventing electrolytic capacitor failures by placing it in the air atmosphere, thereby stabilizing supply voltage and enhancing durability.
Implementation Method 1
both substrates can be cooled easily
Data Source
AI summary
A vacuum pump having substrates which can be wired together easily and cooled easily. A substrate unit structure is formed by covering the opening of the casing of the pump main unit with a plate functioning also as the casing of the control unit. Pins of a terminal fixed while penetrating the plate are soldered directly to an active magnetic bearing (AMB) control substrate and an aerial connection substrate in order to integrate these components. The casing and sealing structures can be of simple construction. A drip-proof structure can be made with the terminal at low cost without using expensive drip-proof connectors. Further, by cooling the plate, electronic components mounted respectively on the AMB control substrate in a vacuum atmosphere and the aerial connection substrate in an air atmosphere can be cooled simultaneously.