Vacuum Pump Substrate Pin Attachment for Thermal Stress Reduction
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Solution Overview
Problem
The accumulation of heat in vacuum pumps leads to significant thermal expansion of connector pins, causing potential cracks in soldered parts and risking damage to electronic elements due to the difficulty in heat dissipation and the resulting stress.
Innovation Solution
The design includes pins soldered near one end edge of a substrate, with an attachment on the opposite end edge to minimize stress on solder connections and uses a molding material with a Shore D hardness of less than 50 to reduce deformation pressure on electronic elements, allowing for flexible substrate bending without damaging the elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the substrate is directly connected to the connector through soldering to simplify wiring, then the number of pins and wiring complexity are reduced, but heat accumulates in the pump main unit causing thermal expansion of connector pins that leads to cracks in solder connection parts
Solution Approach 1:
The substrate is divided into functionally distinct regions: a first region containing electronic elements and a second region containing attachment portions. This segmentation allows the attachment portions to be positioned away from the electronic elements, enabling the substrate to bend at the attachment portions during thermal expansion without transmitting stress to the electronic elements or solder connections.
Solution Approach 2:
The attachment portions serve as intermediary elements that absorb and dissipate the stress generated by thermal expansion. By positioning attachments at specific locations away from electronic elements, these intermediary points allow the substrate to deform safely without compromising the integrity of solder connections or electronic components.
2Device complexity
If the substrate is directly connected to the connector through soldering to simplify wiring, then the number of pins and wiring complexity are reduced, but thermal expansion of connector pins causes damage to electronic elements
Solution Approach 1:
The substrate is divided into functionally distinct regions: a first region containing electronic elements and a second region containing attachment portions. This segmentation allows the attachment portions to be positioned away from the electronic elements, enabling the substrate to bend at the attachment portions during thermal expansion without transmitting stress to the electronic elements or solder connections.
Solution Approach 2:
The attachment portions serve as intermediary elements that absorb and dissipate the stress generated by thermal expansion. By positioning attachments at specific locations away from electronic elements, these intermediary points allow the substrate to deform safely without compromising the integrity of solder connections or electronic components.
3Stability of the object's composition
If attachments are arranged on both sides of the substrate to secure it, then the substrate is firmly fixed, but the bend angle increases during thermal expansion causing stress on solder connections
Solution Approach 1:
Different regions of the substrate are given different functional qualities: the first region contains electronic elements requiring stability, while the second region contains attachment portions designed to accommodate bending. This local differentiation allows the substrate to maintain firm fixation while allowing controlled bending at attachment portions during thermal expansion.
Solution Approach 2:
The attachment portions are asymmetrically positioned in the second region away from the center and electronic elements. This asymmetric arrangement creates a bending moment that allows the substrate to deform in a controlled direction during thermal expansion, preventing stress concentration at solder connections while maintaining overall fixation stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the likelihood of cracks in solder connections and minimizes the impact on electronic elements by maintaining a small bend angle and reducing deformation pressure, effectively addressing the thermal expansion issue.
Implementation Method 1
connector pins linearly expand greatly with the accumulated heat
Implementation Method 2
the molding material has a Shore D hardness of less than 50... allows for flexible substrate bending without damaging the elements
Data Source
AI summary
A vacuum pump including a pump main unit and a control unit is disclosed. The control unit includes a substrate having electronic elements mounted thereon and terminal pins soldered to the substrate at a first end edge of the substrate. The substrate is mounted to a plate via an attachment near a second end edge opposing the first end edge and the plate is mounted to the pump main unit. The terminal pins extend through the plate. Upon linear thermal expansion of the terminal pins, by reason of the location of the terminal pins near the first end edge and the attachment near the second end edge, stresses in the soldered pin connections are reduced. A molding material having a Shore hardness of less than 50, is molded around the electronic elements on the substrate in one embodiment.