Vacuum Pumping Arrangement with Valve Modules for Semiconductor Fabrication
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Solution Overview
Problem
Current vacuum pumping arrangements in semiconductor fabrication facilities are inefficient in terms of cost and space utilization, and require multiple primary pumps to handle different process flows, which can lead to pressure fluctuations and increased maintenance needs.
Innovation Solution
A vacuum pumping arrangement with dual primary pumps and common pumping lines, each optimized for specific process flows, along with valve modules and abatement modules strategically positioned to manage process gases and reduce pipeline requirements, allowing for efficient handling of deposition and cleaning processes while minimizing corrosion and pressure variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple primary pumps are used to handle different process flows (deposition and cleaning), then each process flow can be handled with optimized pump configuration, but the number of pumps increases leading to increased space requirements and higher capital costs
Solution Approach 1:
The patent applies multi-functionality by enabling a single primary pump to handle both deposition and cleaning process flows through the use of valve modules that selectively direct different process gases to the pump. The pump is configured with heating elements and cooling systems to adapt its operating conditions for different gas types, thereby eliminating the need for separate dedicated pumps for each process type.
2Adaptability or versatility
If multiple primary pumps are used for different process flows, then each pump can be optimized for its specific function, but the complexity of the vacuum pumping arrangement increases
Solution Approach 1:
The patent applies segmentation by dividing the single primary pump into functional segments through valve modules that separate different process flows (deposition and cleaning) into distinct pathways. This allows the pump to be selectively connected to different process chambers based on the required process type, maintaining optimization for each process while avoiding the complexity of multiple complete pump systems.
3Device complexity
If a common pumping line is used to service multiple process chambers, then the number of pumps and pipeline requirements are reduced, but pressure changes in one chamber can affect pressure stability in other chambers
Solution Approach 1:
The patent applies the intermediary principle by introducing valve modules as mediating components between process chambers and the common pumping line. These valve modules act as selective gatekeepers that control which chamber is connected to the pump at any given time, preventing pressure changes in one chamber from directly affecting other chambers while still utilizing the common pumping infrastructure.
4Adaptability or versatility
If deposition process flows are handled through a pump optimized for cleaning processes, then a single pump configuration can serve multiple functions, but corrosion damage to the pump increases
Solution Approach 1:
The patent applies preliminary action by implementing a heating system that pre-heats the pump and pipeline components before deposition process gases are introduced. This preliminary heating creates a protective thermal environment that prevents corrosive deposition gases from directly attacking the pump internals, thereby extending pump life while maintaining multi-functionality.
Data Source
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AI summary
In the field of semiconductor fabrication there is a need to improve the efficiency of associated pumping arrangements, particularly in relation to the manufacture of silicon chips. A vacuum pumping arrangement for evacuating at least first and second vacuum process chambers, said vacuum pumping arrangement comprising: at least first and second vacuum pumps, said first vacuum pump inlet in fluid communication with an outlet of the first process chamber, said second vacuum pump inlet in fluid communication with an outlet of the second process chamber; at least first and second valve modules, said valve modules being at least three way valve modules comprising an inlet, a first outlet and a second outlet, said first valve module inlet in fluid communication with an outlet of the first vacuum pump, said second valve arrangement inlet in fluid communication with an outlet of the second vacuum pump; at least first and second common pumping lines, the first common pumping line in fluid communication with the first outlets of both of the first and second valve modules, the second common pumping line in fluid communication with the second outlets of both the first and second valve modules, wherein the first and second vacuum pumps are secondary vacuum pumps and each of the first and second common pumping lines comprises at least respective first and second primary vacuum pump to provide sufficient pumping capacity for each of the at least first and second vacuum pumps when in fluid communication via the first and/or second valve modules; and wherein at least one of the common pumping lines is in fluid communication with an abatement device.