Vacuum Robot Transfer Control for Linear Tool Throughput

The patent applies dynamics by making the transferring method adaptable and changeable based on processing conditions. The controlling unit dynamically selects between different transferring methods (first method for single-process wafers, second method for multi-process wafers) according to the specific processing step and operation conditions, rather than using a fixed transferring approach. This dynamic adaptation resolves the contradiction by enabling efficient transferring in the linear tool structure without requiring a cluster tool configuration.

The patent segments the transferring control into distinct methods based on processing characteristics. The first transferring method is applied to processing steps completed in a single process chamber, while the second transferring method is applied to processing steps completed through multiple process chambers. This segmentation allows each method to be optimized for its specific use case, improving operation rates without significantly increasing overall control complexity through automated selection based on processing step identification.

The patent applies preliminary action by determining and storing the processing time for each processing step in advance. The controlling unit uses this pre-determined processing time information to select the appropriate transferring method before actual wafer transfer begins. This preliminary preparation enables optimized transferring decisions without adding complexity during the actual transfer operation, thereby reducing waiting times and improving throughput.