Vacuum Robotic Arm Calibration Using Jig Wafer Distance Sensing
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Solution Overview
Problem
Conventional robotic arm correction systems require manual intervention and chamber opening for retooling, leading to increased tool downtime and reduced calibration accuracy.
Innovation Solution
A device equipped with distance measuring sensors and a control system to automatically adjust the position and height of robotic arms, allowing for precise alignment and correction without opening the chamber, using a driving device to move the jig wafer into alignment with the wafer chuck.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual correction using external handles and correction jigs is used, then the robotic arm position can be adjusted, but the chamber must be opened and retooling work is required, increasing tool downtime
Solution Approach 1:
The patent replaces the manual mechanical correction system (handles and jigs) with an automated optical measurement and control system. Distance measuring sensors detect the position of the robotic arm and wafer chuck, and a control device automatically calculates and adjusts the robotic arm position, eliminating the need for manual intervention and chamber opening.
Solution Approach 2:
The correction system performs self-calibration by using the wafer chuck itself as the reference object. The distance measuring sensors measure the position relationship between the robotic arm and the wafer chuck, and the system automatically adjusts without requiring external correction jigs or manual operations.
2Manufacturing precision
If external correction jigs are used, then correction can be performed, but retooling work is required after correction, increasing tool downtime
Solution Approach 1:
The patent eliminates the need for physical correction jigs by using a non-contact optical measurement system. Distance measuring sensors detect positions optically, and the control device processes this information to achieve correction, completely removing the retooling step required by traditional mechanical jig-based methods.
Solution Approach 2:
The patent introduces distance measuring sensors as an intermediary between the robotic arm and the operator. These sensors act as mediators that automatically detect position information and transmit it to the control device, replacing the need for direct manual measurement and physical correction jigs.
3Manufacturing precision
If conventional correction systems are used, then manual correction is possible, but chamber opening is required, increasing tool downtime
Solution Approach 1:
The patent replaces complex manual mechanical correction operations with a simplified automated system. Distance measuring sensors and a control device work together to perform alignment automatically, reducing the need for complex physical correction mechanisms and chamber opening procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances calibration accuracy, reduces tool downtime, and improves efficiency by eliminating the need for manual retooling and chamber opening during the correction process.
Implementation Method 1
a first distance measuring sensor positioned at a center position of a back surface of the first wafer body, wherein the first distance measuring sensor is configured to detect whether a center of the first jig wafer is aligned with a center of a wafer chuck
Implementation Method 2
a second distance measuring sensor positioned on the front surface of the first wafer body and on an outside of the first jig, wherein the second distance measuring sensor is configured to detect a lifting height of the first robotic arm when the first robotic arm controls a pick-and-place operation the first jig wafer on an upper surface of the wafer chuck
Data Source
AI summary
Embodiments relate to a device for correcting a robotic arm, including: a first robotic arm positioned in a vacuum transmission chamber; a first jig wafer comprising a first wafer body and a first jig positioned on a front surface of the first wafer body; a first distance measuring sensor positioned at a center position of a back surface of the first wafer body and configured to detect whether a center of the first jig wafer is aligned with a center of a wafer chuck; a second distance measuring sensor positioned on the front surface of the first wafer body and on an outside of the first jig and configured to detect a lifting height of the first robotic arm when the first robotic arm controls a pick-and-place operation the first jig wafer on an upper surface of the wafer chuck.


