Vacuum Sample Stage Segmentation for Maintenance Access
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Solution Overview
Problem
Vacuum processing apparatuses face inefficiencies in maintenance due to increased size and weight of components, leading to difficulties in handling and cleaning, which results in decreased processing efficiency and longer downtime for calibration and maintenance operations.
Innovation Solution
The apparatus includes a sample stage with a metallic base and insulating member, featuring temperature sensors that penetrate the base plate and insulating member, allowing for easy removal and calibration, and a cylindrical base member surrounding the processing chamber to maintain atmospheric pressure, facilitating efficient maintenance and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the vacuum processing apparatus is designed to process larger diameter semiconductor wafers, then the processing capability is improved, but the size and weight of components increase, making them difficult to handle and maintain
Solution Approach 1:
The sample stage assembly is divided into separable components: the base plate with temperature sensors can be detached from the electrostatic chuck assembly. This segmentation allows the heavy base plate to be handled independently during maintenance, reducing the effective weight that maintenance personnel must manage while preserving the overall processing capability of the larger apparatus
2Adaptability or versatility
If the components are made larger to accommodate increased wafer diameter, then the processing capacity is improved, but the maintenance time increases due to difficulty in removal and cleaning
Solution Approach 1:
The base plate is designed as a separate removable component from the electrostatic chuck assembly, allowing maintenance personnel to quickly detach and clean the base plate without having to disassemble the entire sample stage. This segmentation significantly reduces maintenance time despite the larger component size
Solution Approach 2:
The temperature sensors are extracted as separate elements that penetrate through the base plate, allowing the base plate to be removed and cleaned independently. The sensors can be recalibrated or replaced without removing the entire sample stage assembly, thereby reducing maintenance time
3Strength
If the base plate and support structure are made heavier to provide sufficient strength and stability, then the structural integrity is improved, but the ease of removal and repositioning during maintenance deteriorates
Solution Approach 1:
The heavy base plate is segmented from the electrostatic chuck assembly through a detachable connection structure. This allows the base plate to be removed and repositioned during maintenance despite its weight, while maintaining structural integrity during operation. The segmentation enables independent handling of the base plate without requiring removal of the entire assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances processing efficiency by reducing maintenance time, improving operation rates, and ensuring uniform processing through axial symmetry and easy access for cleaning and calibration.
Implementation Method 1
a plurality of temperature sensors each of which penetrates the base plate and the insulating member, and which is inserted into the base material
Implementation Method 2
a workpiece such as a semiconductor wafer held on a sample stage including an electrostatic chuck
Implementation Method 3
processing gas is used, and a reaction product adheres to an inside of the vacuum processing chamber when the processing gas is put in a plasma state to process a workpiece (wafer)
Data Source
AI summary
A sample stage which is disposed inside a vacuum processing chamber and on which a wafer to be processed is placed on an upper surface thereof includes a metallic base material, a metallic substrate insulated from the base material below the base material with an insulating member interposed therebetween, and a base which is disposed below the substrate, has a space set to an atmospheric pressure therein, and is connected to the substrate by an opening above the space being covered, the insulating member has a ring-shaped member made of ceramic with a seal member airtightly sealing a part between a space of an inner peripheral side communicating with an outside of the vacuum vessel and set to the atmospheric pressure and an inside of the processing chamber interposed between the base material and an outer peripheral side portion of the substrate, a plurality of temperature sensors installed to penetrate the substrate and inserted into the base material is included, and the base material, the insulating member, and the substrate are configured to be integrally removable to an outside of the processing chamber in a state in which the plurality of temperature sensors is installed.