Vacuum Sealed Anti-Static Bag for Server Component Transport
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Solution Overview
Problem
Edge or Telco datacenters often lack heating or cooling capabilities, causing information handling systems and their components to operate outside their designed temperature range, leading to potential damage from condensation and environmental factors during transportation.
Innovation Solution
A method and kit for transporting electronic components using an anti-static bag that is vacuum sealed and includes a desiccant and temperature sensor, minimizing condensation formation and protecting against static electricity and other environmental hazards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If electronic components are transported from cold to warm environments without temperature control, then transportation is simplified, but condensation forms on components causing damage
Solution Approach 1:
The patent uses a vacuum-sealed anti-static bag to create an inert environment that prevents moisture and condensation from contacting electronic components during temperature transitions. By removing air and moisture from the bag before sealing, the components are protected from condensation damage while being transported between temperature-controlled and non temperature-controlled environments.
Solution Approach 2:
The patent extracts harmful elements (moisture, air, condensation) from the transportation environment by using a vacuum pump to remove air from the anti-static bag before sealing. This extraction of harmful substances allows components to be transported without temperature control while preventing condensation formation.
2Loss of energy
If components are removed from temperature-controlled environments, then energy consumption is reduced, but components operate outside designed temperature range
Solution Approach 1:
The patent performs preliminary actions by placing desiccant material and temperature indicators in the anti-static bag before sealing. These preliminary preparations enable the bag to maintain a stable, dry environment and provide temperature monitoring without requiring active heating or cooling during transportation, thus reducing energy consumption while protecting component reliability.
3Device complexity
If traditional anti-static bags are used without vacuum sealing, then device complexity is reduced, but condensation and environmental factors damage components
Solution Approach 1:
The patent creates an inert atmosphere inside the anti-static bag by vacuum sealing it to remove air and moisture. This inert environment protects electronic components from condensation and environmental damage during transportation, while the bag structure itself remains relatively simple without requiring active heating or cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prolongs the life of electronic components by preventing condensation and exposure to harmful environmental factors during transportation, ensuring safe operation when the components are reintroduced into their intended environment.
Implementation Method 1
With the use of a vacuum pump, the air inside of the anti-static bag is then removed
Implementation Method 2
placing a desiccant in an anti-static bag
Implementation Method 3
The bag includes an opening having an air tight seal, a suction valve, and an insulating window
Data Source
AI summary
Embodiments of the present invention provide a method, anti-static bag, and kit for transporting an electronic component in the anti-static bag. Along with the electronic component, a desiccant and a temperature indicator are added to the anti-static bag. The anti-static bag is then vacuum sealed to reduce the air and moisture in the anti-static bag. The vacuum sealed bag, desiccant, and temperature indicator, insure that the formation of condensation on the electronic component will be minimized, which will potentially prolong the life of the electronic component.