Vacuum-Sealed Metallic Peltier Module for EUV Sensor Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing cooling methods for image sensors in EUV optical systems, such as Peltier modules, face inefficiencies and contamination issues under vacuum conditions, leading to inadequate cooling performance and potential impairment of image sensor performance in mask inspection applications.
Innovation Solution
A Peltier module with metallic plates forming the hot and cold sides, where the cold side is designed as a vacuum-compatible component with a vacuum seal, enabling improved cooling performance and maintaining vacuum integrity, using materials like aluminum and stainless steel alloys, and incorporating a heat dissipation block and closed-loop temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional Peltier modules with ceramic plates are used for cooling image sensors, then cooling function is provided, but cooling performance is insufficient and contamination occurs under vacuum conditions
Solution Approach 1:
The patent changes the material parameters of the Peltier module plates from ceramic to metallic materials (such as aluminum or stainless steel). This parameter change enables the plates to provide both excellent thermal conductivity for improved cooling performance and compatibility with vacuum environments, thereby resolving the contradiction between insufficient cooling performance and contamination issues under vacuum conditions.
Solution Approach 2:
The patent employs composite material construction where metallic plates are combined with Peltier pellets to create a hybrid structure. The metallic plates provide superior thermal conduction and vacuum compatibility, while the semiconductor Peltier pellets provide the active cooling function. This composite approach achieves both high cooling performance and reliability under vacuum conditions.
2Temperature
If cooling channels with cooling fluid are used, then cooling function is provided, but device complexity increases and handling under vacuum conditions becomes difficult
Solution Approach 1:
The patent extracts the cooling fluid and complex cooling channel structure from the system, replacing them with a solid-state Peltier module. This elimination of fluid-based cooling systems removes the complexity of cooling fluid connections and handling under vacuum conditions while maintaining effective cooling through the metallic plate structure.
Solution Approach 2:
The patent replaces the mechanical fluid circulation system with an electrical solid-state cooling system. Instead of using pumps, tubes, and flowing coolant, the Peltier module uses electrical current to generate the Peltier effect, providing cooling through direct thermal conduction in the metallic plates. This substitution dramatically simplifies the device structure and eliminates vacuum handling issues.
3Temperature
If Peltier modules are used for active cooling, then cooling function is provided, but vacuum seal integrity is compromised
Solution Approach 1:
The patent changes the material composition and surface properties of the Peltier module plates from ceramic to metallic materials. This parameter change enables the plates to be compatible with vacuum environments and allows for effective vacuum sealing, preventing contamination while maintaining the active cooling function through the Peltier effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves enhanced cooling performance of over 20 W/cm2, maintains vacuum conditions, and allows for active cooling below ambient temperatures, ensuring reliable image sensor operation in EUV environments.
Implementation Method 1
Peltier modules, which are arranged, as a plurality of pellets, for example between two ceramic plates, one of which forms the hot side and the other forms the cold side of the Peltier module
Implementation Method 2
the first plate and the second plate are each made of a metallic material
Data Source
AI summary
The invention relates to a Peltier module, to an assembly and to an apparatus for mask inspection. A Peltier module according to the invention has a plurality of Peltier pellets, which are made of a semiconductor material and are arranged between a first plate forming a hot side and a second plate forming a cold side, wherein the first plate and the second plate are each made of a metallic material, and wherein a vacuum seal component is provided on the second plate.